18749503. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE simplified abstract (FUJI ELECTRIC CO., LTD.)
Contents
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Motoyoshi Kubouchi of Matsumoto-city (JP)
Makoto Shimosawa of Matsumoto-city (JP)
Takashi Yoshimura of Matsumoto-city (JP)
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18749503 titled 'SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a semiconductor substrate, an interlayer dielectric film with a contact hole, a first alloy layer, an oxide layer, a barrier metal layer, and a plug layer.
- The semiconductor substrate serves as the foundation of the device.
- The interlayer dielectric film is positioned above the semiconductor substrate and contains a contact hole for electrical connections.
- The first alloy layer is located on the upper surface of the semiconductor substrate below the contact hole.
- An oxide layer is present on top of the first alloy layer within the contact hole.
- A conductive barrier metal layer is provided above the oxide layer within the contact hole.
- A plug layer is placed above the barrier metal layer within the contact hole.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the efficiency and performance of electronic components.
Problems Solved: - Enhances the reliability and functionality of semiconductor devices. - Facilitates better electrical connections within the device.
Benefits: - Increased device performance and reliability. - Enhanced electrical connectivity. - Improved overall efficiency of semiconductor devices.
Commercial Applications: Title: Advanced Semiconductor Device Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and other consumer electronics. It can also be beneficial in the development of advanced industrial equipment and machinery.
Questions about Semiconductor Device Technology: 1. How does this technology impact the overall efficiency of semiconductor devices? This technology improves the efficiency of semiconductor devices by enhancing electrical connectivity and reliability.
2. What are the potential applications of this advanced semiconductor device technology? The applications of this technology include the manufacturing of high-performance electronic devices and industrial equipment.
Original Abstract Submitted
Provided is a semiconductor device comprising: a semiconductor substrate; an interlayer dielectric film that has a contact hole and is provided above the semiconductor substrate; a first alloy layer provided on an upper surface of the semiconductor substrate below the contact hole; an oxide layer provided on an upper surface of the first alloy layer in the contact hole; a barrier metal layer that is conductive and provided above the oxide layer in the contact hole; and a plug layer provided above the barrier metal layer in the contact hole.
