18748263. SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS simplified abstract (Tokyo Electron Limited)
Contents
- 1 SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Questions about the Technology
- 1.11 Original Abstract Submitted
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Organization Name
Inventor(s)
SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18748263 titled 'SUBSTRATE SUPPORT AND PLASMA PROCESSING APPARATUS
Simplified Explanation
The patent application describes a substrate support and plasma processing apparatus designed to accurately place an edge ring on an electrostatic chuck.
Key Features and Innovation
- Substrate support includes a base, a first electrostatic chuck region for holding a substrate, and a second electrostatic chuck region for holding an edge ring.
- The second electrostatic chuck region has a positioning pin made of a material with a similar linear expansion coefficient to the chuck region material.
Potential Applications
This technology can be used in semiconductor manufacturing processes where precise positioning of edge rings is crucial for quality control.
Problems Solved
The technology addresses the challenge of accurately placing edge rings on electrostatic chucks, ensuring stable and efficient plasma processing.
Benefits
- High positional accuracy of edge rings on electrostatic chucks.
- Improved quality control in semiconductor manufacturing processes.
- Enhanced stability and efficiency in plasma processing.
Commercial Applications
- Semiconductor manufacturing industry for improved quality control.
- Plasma processing equipment manufacturers for enhanced performance.
Questions about the Technology
How does the material of the positioning pin contribute to the accuracy of edge ring placement?
The material of the positioning pin, with a similar linear expansion coefficient to the chuck region material, ensures consistent and precise positioning of the edge ring.
What are the potential implications of this technology for the semiconductor industry?
This technology can lead to improved efficiency, quality control, and overall performance in semiconductor manufacturing processes.
Original Abstract Submitted
A substrate support and a plasma processing apparatus for placing an edge ring on an electrostatic chuck with high positional accuracy. A substrate support includes: a base, a first electrostatic chuck region disposed at an upper portion of the base and having a substrate support surface, and the first electrostatic chuck holding a substrate on the substrate support surface; and a second electrostatic chuck region disposed at the upper portion of the base to surround the first electrostatic chuck region and having a ring support surface, and the second electrostatic chuck holding an edge ring on the ring support surface. The second electrostatic chuck region is provided with a positioning pin of the edge ring, the positioning pin being formed of a material having a linear expansion coefficient substantially equal to a linear expansion coefficient of a material forming the second electrostatic chuck region.
