18748127. ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Masatoshi Aketa of Kyoto-shi (JP)
ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18748127 titled 'ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE
The patent application describes an electronic component with a substrate, a chip, electrodes, a sealing insulation layer, and external terminals.
- The electronic component has a substrate with two main surfaces, a chip with two main surfaces, and electrodes on the chip's main surfaces.
- The chip is placed on one main surface of the substrate, and a sealing insulation layer seals the chip on the substrate.
- The sealing insulation layer has a sealing main surface that faces the substrate's main surface, and external terminals penetrate through it.
Potential Applications: - This technology can be used in various electronic devices such as smartphones, tablets, and computers. - It can also be applied in automotive electronics, medical devices, and industrial equipment.
Problems Solved: - Provides a secure and reliable way to integrate chips into electronic components. - Ensures proper insulation and protection for the chip within the component.
Benefits: - Enhances the performance and durability of electronic devices. - Simplifies the manufacturing process of electronic components.
Commercial Applications: - This technology can be utilized by electronics manufacturers to improve the quality and efficiency of their products. - It can also open up new opportunities for innovative electronic designs in various industries.
Questions about the Technology: 1. How does the sealing insulation layer protect the chip within the electronic component? 2. What are the advantages of having external terminals exposed from the sealing main surface of the sealing insulation layer?
Original Abstract Submitted
An electronic component includes a substrate having a first main surface on one side and a second main surface on the other side, a chip having a first chip main surface on one side and a second chip main surface on the other side, and a plurality of electrodes formed on the first chip main surface and/or the second chip main surface, the chip being arranged on the first main surface of the substrate, a sealing insulation layer that seals the chip on the first main surface of the substrate such that the second main surface of the substrate is exposed, the sealing insulation layer having a sealing main surface that opposes the first main surface of the substrate, and a plurality of external terminals formed to penetrate through the sealing insulation layer so as to be exposed from the sealing main surface of the sealing insulation layer.
