18747987. CHIP ON FLEX simplified abstract (BOE Technology Group Co., Ltd.)
Contents
CHIP ON FLEX
Organization Name
BOE Technology Group Co., Ltd.
Inventor(s)
Jiangsheng Wang of Beijing (CN)
CHIP ON FLEX - A simplified explanation of the abstract
This abstract first appeared for US patent application 18747987 titled 'CHIP ON FLEX
The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base with a first opening and a bonding area with metal bonding pads. A spacing area with a preset range is provided between the first opening and the bonding area on the flexible base. Additionally, a reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area, and the bonding area.
- Flexible base with a first opening and a bonding area with metal bonding pads
- Spacing area with a preset range between the first opening and the bonding area
- Reinforcement sheet located on a portion of the flexible base
- Touch assembly and display device applications
- Improved durability and flexibility of the chip on flex technology
Potential Applications: - Consumer electronics - Automotive displays - Medical devices
Problems Solved: - Enhanced durability of flexible electronic components - Improved performance in various applications
Benefits: - Increased flexibility and durability - Enhanced reliability in electronic devices - Cost-effective manufacturing process
Commercial Applications: Title: "Innovative Chip on Flex Technology for Enhanced Display Devices" This technology can be used in various commercial applications such as smartphones, tablets, smartwatches, and automotive displays. The improved durability and flexibility of the chip on flex technology make it a valuable component in the consumer electronics market.
Questions about Chip on Flex Technology: 1. How does the reinforcement sheet enhance the durability of the flexible base? The reinforcement sheet provides additional support to the flexible base, increasing its durability and reliability in various applications.
2. What are the potential market implications of using chip on flex technology in consumer electronics? Chip on flex technology can lead to cost-effective manufacturing processes and improved performance in electronic devices, making it a valuable component in the consumer electronics market.
Original Abstract Submitted
The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.
