18747951. SUBSTRATE PROCESSING APPARATUS simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SUBSTRATE PROCESSING APPARATUS
Organization Name
Inventor(s)
Sangjine Park of Suwon-si (KR)
SUBSTRATE PROCESSING APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18747951 titled 'SUBSTRATE PROCESSING APPARATUS
The abstract describes a substrate processing apparatus that includes a processing chamber with a substrate support, a surface tension reducing agent supply system, and a controller to control the supply of the surface tension reducing agent.
- The apparatus supplies a surface tension reducing agent as a gas to the processing chamber.
- The surface tension reducing agent supply system has supply ports to introduce the agent into the internal space and discharge ports to remove developer from the internal space.
Potential Applications: - Semiconductor manufacturing - Thin film deposition processes - Solar cell production
Problems Solved: - Improving substrate processing efficiency - Enhancing film quality - Minimizing defects on substrates
Benefits: - Increased productivity - Improved product quality - Reduced maintenance costs
Commercial Applications: Title: Enhanced Substrate Processing Apparatus for Semiconductor Manufacturing This technology can be used in semiconductor fabrication facilities to optimize substrate processing and improve overall production efficiency.
Questions about the technology: 1. How does the surface tension reducing agent impact the substrate processing?
The surface tension reducing agent helps to improve the quality of the films deposited on the substrates by reducing defects and enhancing uniformity.
2. What are the key advantages of using a surface tension reducing agent in substrate processing?
The use of a surface tension reducing agent can lead to higher productivity, better product quality, and cost savings in maintenance.
Original Abstract Submitted
A substrate processing apparatus includes a processing chamber having an internal space and a substrate support within the internal space, a surface tension reducing agent supply system that supplies a surface tension reducing agent as a gas to the processing chamber, and a controller that controls the supply of the surface tension reducing agent via the surface tension reducing agent supply system. The surface tension reducing agent supply system includes at least one supply port that is configured to supply the surface tension reducing agent to the internal space and at least one discharge port that is configured to remove developer from the internal space.
