18746188. DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES simplified abstract (Intel Corporation)

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

Organization Name

Intel Corporation

Inventor(s)

Aleksandar Aleksov of Chandler AZ (US)

Adel A. Elsherbini of Chandler AZ (US)

Shawna M. Liff of Scottsdale AZ (US)

Johanna M. Swan of Scottsdale AZ (US)

Feras Eid of Chandler AZ (US)

Randy B. Osborne of Beaverton OR (US)

Van H. Le of Beaverton OR (US)

DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18746188 titled 'DIRECT BONDING IN MICROELECTRONIC ASSEMBLIES

The microelectronic assembly described in the abstract involves coupling microelectronic components together through direct bonding, utilizing metal contacts and dielectric materials.

• The assembly includes a first microelectronic component with an organic dielectric material, a second component with an inorganic dielectric material in the direct bonding region, and a third component connected through wire bonding or solder.
• The direct bonding region plays a crucial role in connecting the components securely and efficiently.
• This innovative approach enhances the performance and reliability of microelectronic assemblies.
• The use of different dielectric materials in the direct bonding region allows for improved electrical insulation and signal transmission.
• The combination of organic and inorganic materials in the assembly provides a unique advantage in terms of functionality and durability.

Potential Applications:

• This technology can be applied in various microelectronic devices such as sensors, actuators, and communication systems.
• It can also be used in medical devices, automotive electronics, and aerospace applications where reliability and performance are critical.

Problems Solved:

• Addresses the need for secure and efficient coupling of microelectronic components.
• Improves electrical insulation and signal transmission in microelectronic assemblies.
• Enhances the overall performance and reliability of microelectronic devices.

Benefits:

• Improved performance and reliability of microelectronic assemblies.
• Enhanced electrical insulation and signal transmission capabilities.
• Versatile applications in various industries including healthcare, automotive, and aerospace.

Commercial Applications:

• Title: Advanced Microelectronic Assembly Technology for Enhanced Performance and Reliability
• This technology has significant commercial potential in the microelectronics industry, offering improved functionality and durability for a wide range of applications.
• It can attract interest from manufacturers of electronic devices looking to enhance the performance and reliability of their products.

Questions about Microelectronic Assembly Technology: 1. How does the use of different dielectric materials in the direct bonding region benefit the overall performance of microelectronic assemblies? 2. What are the specific advantages of coupling microelectronic components through direct bonding compared to other traditional methods?

Frequently Updated Research:

• Stay updated on the latest advancements in microelectronic assembly technology to ensure optimal performance and reliability in electronic devices.

Original Abstract Submitted

Disclosed herein are microelectronic assemblies including microelectronic components that are coupled together by direct bonding, as well as related structures and techniques. For example, in some embodiments, a microelectronic assembly may include a first microelectronic component, including an organic dielectric material; a second microelectronic component coupled to the first microelectronic component by a direct bonding region, wherein the direct bonding region includes metal contacts and a dielectric material between adjacent ones of the metal contacts, and wherein the dielectric material includes an inorganic dielectric material; and a third microelectronic component coupled to the first microelectronic component by wire bonding or solder.