18738584. MULTILAYER ELECTRONIC COMPONENT (SAMSUNG ELECTRO-MECHANICS CO., LTD.)
Contents
MULTILAYER ELECTRONIC COMPONENT
Organization Name
SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor(s)
Joon Hyub Cha of Suwon-si (KR)
Dong Jun Jung of Suwon-si (KR)
MULTILAYER ELECTRONIC COMPONENT
This abstract first appeared for US patent application 18738584 titled 'MULTILAYER ELECTRONIC COMPONENT
Original Abstract Submitted
A multilayer electronic component may include a body including a capacitance forming portion including a dielectric layer including a plurality of dielectric grains, and a plurality of internal electrodes alternately disposed to be stacked with the dielectric layer; and an external electrode disposed on the body, wherein the plurality of dielectric grains include a first dielectric grain including a nano domain that is a domain region with a major diameter of 10 nm to 100 nm, and a second dielectric grain including a polar nano region including a domain region with a major diameter of less than 10 nm, and when the number of the first dielectric grains included in the capacitance forming portion is ND, and the number of the second dielectric grains included in the capacitance forming portion is RD, 50%<ND/(ND+RD) may be satisfied.
