18738111. MULTI-CIRCUIT HEAT PUMP (Carrier Corporation)
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Contents
MULTI-CIRCUIT HEAT PUMP
Organization Name
Inventor(s)
Chaitanya Halbe of Liverpool NY (US)
Vishnu Sishtla of Syracuse NY (US)
MULTI-CIRCUIT HEAT PUMP
This abstract first appeared for US patent application 18738111 titled 'MULTI-CIRCUIT HEAT PUMP
Original Abstract Submitted
A multi-circuit heat pump is disclosed. The heat pump comprises an evaporator, a plurality of condensers fluidically connected in series, and a plurality of compressor units configured between the evaporator and the plurality of condensers such that one of the compressor units is fluidically configured between the evaporator and one of the condensers.
