18734886. PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE simplified abstract (CANON KABUSHIKI KAISHA)
Contents
PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE
Organization Name
Inventor(s)
Steven C. Shackleton of Austin TX (US)
Seth J. Bamesberger of Austin TX (US)
Xiaoming Lu of Cedar Park TX (US)
Byung-Jin Choi of Austin TX (US)
PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18734886 titled 'PLANARIZATION PROCESS, PLANARIZATION SYSTEM, AND METHOD OF MANUFACTURING AN ARTICLE
The method described in the abstract involves planarizing a substrate by dispensing formable material onto it, then contacting a superstrate held by a superstrate chuck with the formable material, creating a multilayer structure. The structure includes the superstrate, a film of the formable material, and the substrate. After releasing the multilayer structure from the superstrate chuck, a space is provided between the two. A light source is then positioned into this space, curing the film of the multilayer structure by exposing it to the emitted light.
- Dispensing formable material onto a substrate
- Contacting a superstrate with the formable material to create a multilayer structure
- Releasing the multilayer structure from the superstrate chuck
- Providing a space between the superstrate chuck and the multilayer structure
- Curing the film of the multilayer structure by exposing it to light from a light source
Potential Applications: - Semiconductor manufacturing - Microelectronics industry - Optoelectronics
Problems Solved: - Uneven surfaces on substrates - Improving the quality of multilayer structures - Enhancing the efficiency of curing processes
Benefits: - Improved planarization of substrates - Enhanced precision in multilayer structure formation - Increased efficiency in curing processes
Commercial Applications: "Advanced Planarization Method for Semiconductor Manufacturing: Enhancing Efficiency and Quality"
Questions about the technology: 1. How does this method compare to traditional planarization techniques? 2. What are the specific advantages of using a light source for curing the film in this process?
Frequently Updated Research: Ongoing research in semiconductor manufacturing techniques and materials for planarization processes.
Original Abstract Submitted
A method of planarizing a substrate comprises dispensing formable material onto a substrate, contacting a superstrate held by a superstrate chuck with the formable material on the substrate, thereby forming a multilayer structure including the superstrate, a film of the formable material, and the substrate, releasing the multilayer structure from the superstrate chuck, providing a space between the superstrate chuck and the multilayer structure after the releasing, positioning a light source into the provided space between the superstrate chuck and the multilayer structure, and curing the film of the multilayer structure by exposing the film to light emitted from the light source.
