18733705. SEMICONDUCTOR PACKAGE simplified abstract (Samsung Electronics Co., Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Myungsam Kang of Hwaseong-si (KR)
Jeongseok Kim of Cheonan-si (KR)
Bongju Cho of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18733705 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of several key components:
- A first redistribution structure with a first insulating layer and a first redistribution layer
- A semiconductor chip with a connection pad embedded in the first insulating layer
- A vertical connection structure electrically connected to the first redistribution layer
- An encapsulant encapsulating the semiconductor chip and the vertical connection structure
- A second redistribution structure with a second redistribution layer connected to the vertical connection structure
- A connection bump electrically connected to the first redistribution layer
Potential Applications: - Advanced electronic devices - Integrated circuits - Microprocessors
Problems Solved: - Improved electrical connections - Enhanced packaging efficiency - Increased reliability of semiconductor devices
Benefits: - Higher performance - Enhanced durability - Improved functionality
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for High-Performance Electronics Description: This technology can be utilized in the production of cutting-edge electronic devices, leading to improved performance and reliability in various industries such as telecommunications, automotive, and consumer electronics.
Questions about Semiconductor Packaging Technology: 1. How does this semiconductor packaging technology improve the performance of electronic devices?
- This technology enhances electrical connections and packaging efficiency, resulting in higher performance and reliability of semiconductor devices.
2. What are the potential applications of this advanced semiconductor packaging technology?
- This technology can be applied in various industries such as telecommunications, automotive, and consumer electronics to improve the functionality and durability of electronic devices.
Original Abstract Submitted
A semiconductor package includes: a first redistribution structure having a first surface and a second surface opposing the first surface, and including a first insulating layer and a first redistribution layer disposed on the first insulating layer; a semiconductor chip disposed on the first surface of the first redistribution structure, and including a connection pad electrically connected to the first redistribution layer and embedded in the first insulating layer; a vertical connection structure disposed on the first surface and electrically connected to the first redistribution layer; an encapsulant encapsulating at least a portion of each of the semiconductor chip and the vertical connection structure; a second redistribution structure disposed on the encapsulant and including a second redistribution layer electrically connected to the vertical connection structure; and a connection bump disposed on the second surface and electrically connected to the first redistribution layer.
