18733196. SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Yo Mochizuki of Kyoto-shi (JP)
Kazunori Fuji of Kyoto-shi (JP)
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18733196 titled 'SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
The semiconductor module described in the patent application consists of a conductive member, a semiconductor element, and a heat transfer layer. The conductive member has a first obverse surface facing in a thickness direction, while the semiconductor element includes a first electrode, a first gate electrode, and a second electrode.
- The first electrode connects to the conductive member, and the heat transfer layer is conductively bonded to the first obverse surface and connected to the first electrode.
- The heat transfer layer has a first surface facing the first obverse surface and a second surface facing the semiconductor element, with the second surface spaced from the first gate electrode.
- The second surface is surrounded by the periphery of the first surface as viewed in the thickness direction.
Potential Applications: - This technology can be used in the manufacturing of high-performance semiconductor devices. - It can improve the thermal management of electronic components in various applications such as consumer electronics, automotive systems, and industrial equipment.
Problems Solved: - Enhanced heat dissipation in semiconductor devices. - Improved overall performance and reliability of electronic systems.
Benefits: - Increased efficiency and longevity of semiconductor devices. - Better thermal management leading to improved performance. - Enhanced reliability and reduced risk of overheating.
Commercial Applications: Title: Advanced Thermal Management Solutions for Semiconductor Devices This technology can be commercialized in the semiconductor industry to develop more efficient and reliable electronic devices. It can cater to a wide range of applications, including smartphones, computers, automotive electronics, and industrial machinery.
Questions about Semiconductor Module: 1. How does the heat transfer layer improve the performance of the semiconductor element? The heat transfer layer enhances thermal management by efficiently dissipating heat from the semiconductor element, leading to improved overall performance and reliability.
2. What are the potential market implications of implementing this semiconductor module in electronic devices? By integrating this technology, manufacturers can produce electronic devices with better thermal management, resulting in increased efficiency, reliability, and customer satisfaction.
Original Abstract Submitted
A semiconductor module includes a conductive member, a semiconductor element, and a heat transfer layer. The conductive member includes a first obverse surface facing in a thickness direction. The semiconductor element includes a first electrode and a first gate electrode that face the first obverse surface and a second electrode opposite to the side facing the first obverse surface. The first electrode connects to the conductive member. The heat transfer layer between the first obverse surface and the semiconductor element is conductively bonded to the first obverse surface, and connected to the first electrode. The heat transfer layer includes a first surface facing the first obverse surface and a second surface facing the semiconductor element. The second surface is spaced from the first gate electrode as viewed in the thickness direction. The second surface is surrounded by the periphery of the first surface as viewed in the thickness direction.
