18733073. Inner Wall and substrate Processing Apparatus simplified abstract (Tokyo Electron Limited)
Contents
Inner Wall and substrate Processing Apparatus
Organization Name
Inventor(s)
Yuji Asakawa of Nirasaki City (JP)
Atsushi Tanaka of Nirasaki City (JP)
Hiroyuki Ogawa of Nirasaki City (JP)
Inner Wall and substrate Processing Apparatus - A simplified explanation of the abstract
This abstract first appeared for US patent application 18733073 titled 'Inner Wall and substrate Processing Apparatus
Simplified Explanation: This patent application describes a cylindrical inner wall in a substrate processing apparatus that surrounds a stage where a substrate is placed, with a gap between the inner wall and the stage. The inner wall has slits at the lower end and grooves on the inner surface that extend from the upper end to the lower end and connect to the slits.
Key Features and Innovation:
- Cylindrical inner wall with slits and grooves for substrate processing.
- Allows for improved control and manipulation of the substrate during processing.
Potential Applications: This technology can be used in various substrate processing applications such as semiconductor manufacturing, thin film deposition, and surface treatment processes.
Problems Solved:
- Enhanced substrate control and stability during processing.
- Improved efficiency and accuracy in substrate processing.
Benefits:
- Increased precision in substrate processing.
- Reduction in processing time and material wastage.
Commercial Applications:
- Semiconductor industry for wafer processing.
- Display industry for thin film deposition.
- Solar panel manufacturing for surface treatment processes.
Prior Art: Readers interested in exploring prior art related to this technology can start by researching patents and publications in the field of substrate processing apparatus design and innovation.
Frequently Updated Research: Stay updated on the latest advancements in substrate processing technology, including developments in inner wall design and substrate manipulation techniques.
Questions about Substrate Processing Technology: 1. What are the key advantages of using a cylindrical inner wall with slits and grooves in substrate processing? 2. How does this technology improve the overall efficiency of substrate processing operations?
Original Abstract Submitted
A cylindrical inner wall used in a substrate processing apparatus and surrounding a stage on which a substrate is placed, with a gap between the inner wall and an outer periphery of the stage. The inner wall includes a plurality of slits formed in a lower end of the inner wall, and a plurality of grooves formed in the inner surface of the inner wall to extend from an upper end to the lower end of the inner wall so as to communicate with the slits.
