18731701. WAFER POD TRANSFER ASSEMBLY simplified abstract (Taiwan Semiconductor Manufacturing Company Limited)
Contents
WAFER POD TRANSFER ASSEMBLY
Organization Name
Taiwan Semiconductor Manufacturing Company Limited
Inventor(s)
Chih-Wei Chou of Taipei City (TW)
Sheng-Yuan Lin of Hsinchu (TW)
Yuan-Hsin Chi of Taichung City (TW)
Yin-Tun Chou of Hsinchu City (TW)
Hung-Chih Wang of Taichung City (TW)
Yu-Chi Liu of Taoyuan County (TW)
WAFER POD TRANSFER ASSEMBLY - A simplified explanation of the abstract
This abstract first appeared for US patent application 18731701 titled 'WAFER POD TRANSFER ASSEMBLY
Simplified Explanation: The patent application describes a wafer pod transfer assembly that includes a pin buckle to secure a pin that connects various components of the assembly.
Key Features and Innovation:
- Wafer pod transfer assembly with a pin buckle for securing a pin.
- Transfer axle coupled to the wafer pod port for transferring wafer pods.
- Shaft receiver and shaft connected to the transfer axle.
- Pin passing through the shaft receiver and shaft, secured by the pin buckle.
Potential Applications: The technology can be used in semiconductor manufacturing facilities for transferring wafer pods efficiently and securely.
Problems Solved: The assembly addresses the need for a reliable and secure method of transferring wafer pods within manufacturing processes.
Benefits:
- Enhanced efficiency in wafer pod transfer.
- Improved security and stability during transfer processes.
- Reduction in potential damage to wafer pods.
Commercial Applications: This technology could be valuable for semiconductor companies looking to optimize their manufacturing processes and improve overall efficiency in wafer pod handling.
Prior Art: Readers interested in prior art related to this technology could explore patents or research papers in the field of semiconductor manufacturing equipment and automation.
Frequently Updated Research: Stay updated on advancements in semiconductor manufacturing equipment and automation to see how this technology may evolve in the future.
Questions about Wafer Pod Transfer Assembly: 1. How does the pin buckle enhance the security of the wafer pod transfer assembly? 2. What are the potential cost-saving implications of using this technology in semiconductor manufacturing processes?
Original Abstract Submitted
A wafer pod transfer assembly includes a wafer pod port to receive a wafer pod, a transfer axle coupled to the wafer pod port, a shaft receiver, a shaft coupled to the transfer axle and to the shaft receiver, a pin through the shaft receiver and through the shaft, wherein the pin comprises a first end and a second end, opposite the first end, and a pin buckle including a first loop and a second loop. The pin buckle is coupled to the pin, the first loop encircles the first end of the pin, and the second loop encircles the second end of the pin.
