18731522. PACKAGING STRUCTURE simplified abstract (Huawei Digital Power Technologies Co., Ltd.)
Contents
PACKAGING STRUCTURE
Organization Name
Huawei Digital Power Technologies Co., Ltd.
Inventor(s)
PACKAGING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18731522 titled 'PACKAGING STRUCTURE
Simplified Explanation: The packaging structure described in the patent application includes a housing with a power component inside. The housing consists of a top cover and a bottom housing, each with heat transfer medium channels. Heating devices on circuit boards press against the inner walls of the housing components for efficient heat dissipation.
- The packaging structure includes a housing with a power component inside.
- The housing comprises a top cover and a bottom housing, each with heat transfer medium channels.
- Heating devices on circuit boards press against the inner walls of the housing components for efficient heat dissipation.
Potential Applications: 1. Electronics packaging for high-power density applications. 2. Thermal management systems for electronic devices. 3. Industrial equipment where heat dissipation is critical.
Problems Solved: 1. Achieving high power density in electronic packaging. 2. Improving heat dissipation efficiency. 3. Enhancing thermal management in electronic devices.
Benefits: 1. Increased performance and reliability of electronic devices. 2. Improved thermal efficiency. 3. Enhanced longevity of electronic components.
Commercial Applications: The technology can be applied in industries such as telecommunications, automotive, and aerospace for high-power electronic systems requiring efficient heat dissipation.
Questions about the Technology: 1. How does the housing design contribute to heat dissipation efficiency? 2. What are the potential challenges in implementing this packaging structure in different electronic devices?
Frequently Updated Research: Ongoing research focuses on optimizing the design of the housing components for even better heat dissipation and power management in electronic devices.
Original Abstract Submitted
A packaging structure is provided and may include a housing and a power component. The power component is disposed inside the housing. The housing may include a top cover and a bottom housing. The top cover may have a first heat transfer medium channel inside. The bottom housing may have a second heat transfer medium channel inside. The power component may include a first circuit board and a second circuit board. At least one first heating device may be disposed on the first circuit board. The first heating device may press against an inner wall of the top cover. At least one second heating device may be disposed on the second circuit board, and the second heating device may press against an inner wall of the bottom housing. When the foregoing structure is used, high power density and high heat dissipation efficiency can be achieved.
