18706426. FOLDABLE SUBSTRATES AND METHODS OF MAKING (Corning Incorporated)

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FOLDABLE SUBSTRATES AND METHODS OF MAKING

Organization Name

Corning Incorporated

Inventor(s)

ROBERT ALAN Bellman of ITHACA NY (US)

YUHUI Jin of PAINTED POST NY (US)

PETER JOSEPH Lezzi of CORNING NY (US)

CHUANCHE Wang of HORSEHEADS NY (US)

FOLDABLE SUBSTRATES AND METHODS OF MAKING

This abstract first appeared for US patent application 18706426 titled 'FOLDABLE SUBSTRATES AND METHODS OF MAKING



Original Abstract Submitted

Foldable substrates comprise a first portion, a second portion, and a central portion positioned therebetween. The central portion comprises a first central surface area recessed from a first major surface by a first distance and a second central surface area. A second major surface comprises the second central surface area. A blunted edge extends around an entire periphery of the foldable substrate. The blunted edge comprising a first blunted surface area where the blunted edge meets the first major surface and a second blunted surface area where the blunted edge meets the second major surface. Methods comprise laminating the foldable substrate with support layers before removing a peripheral portion of an initial edge of the foldable substrate to form an intermediate edge. The intermediate edge is contacted with an etchant to form the blunted edge. Methods further comprise removing the support layers from the foldable substrate.