18706115. PROCESSING METHOD AND PROCESSING SYSTEM (Tokyo Electron Limited)
Contents
PROCESSING METHOD AND PROCESSING SYSTEM
Organization Name
Inventor(s)
Kazuya Hisano of Koshi City, Kumamoto (JP)
Yoshihiro Kawaguchi of Kikuchi-gun, Kumamoto (JP)
Gousuke Shiraishi of Kikuchi-gun, Kumamoto (JP)
PROCESSING METHOD AND PROCESSING SYSTEM
This abstract first appeared for US patent application 18706115 titled 'PROCESSING METHOD AND PROCESSING SYSTEM
Original Abstract Submitted
A processing method of processing a combined substrate in which a first substrate and a second substrate are bonded to each other includes: forming, by radiating interface laser light to an interface between the first substrate and the second substrate, a non-bonding region with reduced bonding strength at the interface; inspecting a forming state of the non-bonding region; forming a peripheral modification layer along a boundary between a peripheral portion and a central portion of the first substrate; and removing the peripheral portion starting from the peripheral modification layer. The inspecting of the forming state of the non-bonding region includes: imaging the non-bonding region with a camera; acquiring, from an obtained image of the non-bonding region, a distribution of gray values in a plan view of the non-bonding region; and inspecting the forming state of the non-bonding region by comparing the acquired gray values with a preset threshold value.
