18701844. CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS (FUJI CORPORATION)
Contents
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
Organization Name
Inventor(s)
Kenji Tsukada of Toyota-shi (JP)
CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
This abstract first appeared for US patent application 18701844 titled 'CIRCUIT-FORMING METHOD AND CIRCUIT-FORMING APPARATUS
Original Abstract Submitted
A circuit-forming method includes a first forming step of forming a resin layer including a recessed portion by a first discharge device configured to discharge a curable resin, and a second forming step of forming an electrode inside the recessed portion by a second discharge device, which is configured to discharge a conductive paste, by referring to a first mark formed by the first discharge device. A circuit-forming apparatus includes a first discharge device configured to form a resin layer including a recessed portion by discharging a curable resin, and a second discharge device configured to form an electrode inside the recessed portion by discharging a conductive paste by referring to a first mark formed by the first discharge device.
