18689348. ENCAPSULATION FILM (LG CHEM, LTD.)

ENCAPSULATION FILM

Organization Name

LG CHEM, LTD.

Inventor(s)

Beom Doo Seo of Daejeon (KR)

Jae Seol Ryu of Daejeon (KR)

Kwang Hui Choi of Daejeon (KR)

Jhin Yeong Yoon of Daejeon (KR)

Dong Hwan Ryu of Daejeon (KR)

Yern Seung Kim of Daejeon (KR)

Kyung Inn Kim of Daejeon (KR)

Ho Sung Kang of Daejeon (KR)

ENCAPSULATION FILM

This abstract first appeared for US patent application 18689348 titled 'ENCAPSULATION FILM

Original Abstract Submitted

An encapsulation film, a manufacturing method therefor, an organic electronic device comprising same, and a method for manufacturing an organic electronic device by using same, which provides an encapsulation film that has a structure capable of blocking moisture or oxygen flowing into an organic electronic device from the outside, and long-term reliability of the organic electronic device can be ensured. The encapsulation film includes an encapsulation layer that is a cured product of an encapsulation composition, wherein the encapsulation composition includes an encapsulation resin and a moisture adsorbent, and the encapsulation layer is a single layer and includes a first region, a second region, and a third region in which the concentrations of the moisture adsorbent are different according to the thickness direction.