18682829. CIRCUIT BOARD simplified abstract (LG Innotek Co.,LTD.)

From WikiPatents
Jump to navigation Jump to search

CIRCUIT BOARD

Organization Name

LG Innotek Co.,LTD.

Inventor(s)

Jae Hun Jeong of Seoul (KR)

Jong Bae Shin of Seoul (KR)

Soo Min Lee of Seoul (KR)

CIRCUIT BOARD - A simplified explanation of the abstract

This abstract first appeared for US patent application 18682829 titled 'CIRCUIT BOARD

The circuit board described in the abstract consists of multiple layers, including insulating layers and circuit pattern layers.

  • The second insulating layer of the circuit board has a first region with a cavity and a second region without a cavity.
  • Within the first region of the second insulating layer, there is a first portion that is concave towards the lower surface and a second portion that is convex towards the upper surface.

Potential Applications:

  • This circuit board design could be used in various electronic devices where space-saving and efficient design are crucial.
  • The cavity in the insulating layer could potentially be utilized for housing components or creating a more compact circuit layout.

Problems Solved:

  • This design helps in creating a more compact and efficient circuit board layout.
  • The cavity in the insulating layer allows for better organization and placement of components.

Benefits:

  • Improved space utilization on the circuit board.
  • Enhanced efficiency in circuit design and layout.

Commercial Applications:

  • This technology could find applications in the manufacturing of smartphones, tablets, laptops, and other electronic devices where compact and efficient circuit boards are essential.

Questions about the technology: 1. How does the concave and convex design of the insulating layer benefit the overall functionality of the circuit board? 2. What specific electronic devices could benefit the most from this innovative circuit board design?


Original Abstract Submitted

A circuit board according to an embodiment includes a first insulating layer, a first circuit pattern layer disposed on the first insulating layer; and a second insulating layer disposed on the first insulating layer and the first circuit pattern layer, wherein the second insulating layer includes a first region including a cavity and a second region excluding the first region, wherein the first region of the second insulating layer includes a first portion concave toward a lower surface of the second insulating layer, and a second portion convex toward an upper surface of the second insulating layer.