18681035. PRINTED WIRING BOARD simplified abstract (SUMITOMO ELECTRIC INDUSTRIES, LTD.)
Contents
PRINTED WIRING BOARD
Organization Name
SUMITOMO ELECTRIC INDUSTRIES, LTD.
Inventor(s)
Masamichi Yamamoto of Osaka (JP)
Kenichiro Aikawa of Shiga (JP)
PRINTED WIRING BOARD - A simplified explanation of the abstract
This abstract first appeared for US patent application 18681035 titled 'PRINTED WIRING BOARD
The abstract of the patent application describes a printed wiring board with a base film containing a groove on its first major surface, in which a wiring line is placed. The wiring line consists of a metal particle layer on the bottom of the groove and a plating layer on top of the metal particle layer. The metal particle layer is made up of multiple metal particles bonded together through metallic bonding, with each particle partially coated with an organic film.
- Metal particle layer bonded by metallic bonding
- Organic film coating on metal particles
- Wiring line structure with metal particle layer and plating layer
- Groove on base film for wiring line placement
- First major surface of base film utilized for wiring board
Potential Applications: - Electronics manufacturing - Circuit board production - Semiconductor industry
Problems Solved: - Enhanced conductivity in wiring lines - Improved durability of printed wiring boards
Benefits: - Increased efficiency in electronic devices - Longer lifespan of circuit boards - Higher quality connections in electronic components
Commercial Applications: Title: Advanced Printed Wiring Boards for Enhanced Electronic Devices This technology can be used in the production of various electronic devices, such as smartphones, computers, and automotive systems, to improve their performance and reliability. The market implications include increased demand for high-quality circuit boards in the electronics industry.
Prior Art: Readers can start searching for prior art related to this technology in the field of printed circuit board manufacturing, metal particle bonding, and organic film coatings.
Frequently Updated Research: Stay updated on the latest advancements in printed wiring board technology, metal particle bonding techniques, and organic film coatings to enhance the performance of electronic devices.
Questions about Printed Wiring Boards: 1. How does the metal particle layer contribute to the conductivity of the wiring line? 2. What are the advantages of using an organic film coating on the metal particles in the wiring line?
Original Abstract Submitted
A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed on the metal particle layer. The metal particle layer contains a plurality of metal particles bonded to each other by metallic bonding. A surface of each of the plurality of metal particles is partially coated with an organic film.
