18677913. SEMICONDUCTOR STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

SEMICONDUCTOR STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Hsien-Wei Chen of Hsinchu City (TW)

Ming-Fa Chen of Taichung City (TW)

SEMICONDUCTOR STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18677913 titled 'SEMICONDUCTOR STRUCTURE

The abstract describes a semiconductor structure with two semiconductor dies, where the first die has a bonding structure that includes conductive pillars in contact with a dielectric layer.

• The semiconductor structure includes a first semiconductor die with a bonding structure and a second semiconductor die bonded to it.
• The first bonding structure consists of a first dielectric layer, a second dielectric layer, and conductive pillars embedded in both layers.
• Each conductive pillar comprises a conductive barrier layer and a conductive pillar on top, with the pillars in contact with the second dielectric layer.

Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor devices. - It can improve the performance and reliability of integrated circuits.

Problems Solved: - Enhances the bonding strength between semiconductor dies. - Provides efficient electrical connections within the semiconductor structure.

Benefits: - Increased functionality and performance of semiconductor devices. - Enhanced reliability and durability of integrated circuits.

Commercial Applications: Title: Advanced Semiconductor Bonding Technology for Improved Device Performance This technology can be utilized in the production of high-performance electronic devices, such as smartphones, computers, and automotive electronics. It can also benefit the aerospace and defense industries by improving the reliability of critical electronic systems.

Questions about Semiconductor Bonding Technology: 1. How does this semiconductor structure improve the overall performance of integrated circuits? - The technology enhances the electrical connections between semiconductor dies, leading to improved functionality and reliability of integrated circuits.

2. What are the potential challenges in implementing this advanced bonding technology in semiconductor manufacturing? - Some challenges may include optimizing the fabrication process to ensure precise alignment of the semiconductor dies and controlling the quality of the conductive pillars for consistent performance.

Original Abstract Submitted

A semiconductor structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The second semiconductor die is bonded to the first bonding structure of the first semiconductor die. The first bonding structure includes a first dielectric layer, a second dielectric layer covering the first dielectric layer, and first conductors embedded in the first dielectric layer and the second dielectric layer, wherein each of the first conductors includes a first conductive barrier layer covering the first dielectric layer and a first conductive pillar disposed on the first conductive barrier layer, and the first conductive pillars are in contact with the second dielectric layer.