18677392. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Sangcheon Park of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18677392 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
Provided is a semiconductor package including a package substrate, a connection substrate mounted on the package substrate, and including a first conductive connection structure, a first integrated circuit device mounted on the package substrate, and a second integrated circuit device disposed on the connection substrate and the first integrated circuit device, and including a first portion overlapping the first integrated circuit device and a second portion overlapping the connection substrate, wherein one of the first integrated circuit device and the second integrated circuit device includes a photonic integrated circuit device to which an optical fiber is attached, and the other of the first integrated circuit device and the second integrated circuit device includes an electronic integrated circuit device, and wherein the second integrated circuit device is electrically connected to the package substrate via the first conductive connection structure of the connection substrate.
