18675560. SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
Contents
SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor(s)
Shu-Shen Yeh of Taoyuan City (TW)
Chin-Hua Wang of New Taipei City (TW)
Po-Yao Lin of Zhudong Township (TW)
Shin-Puu Jeng of Po-Shan Village (TW)
SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18675560 titled 'SEMICONDUCTOR DIE PACKAGE WITH RING STRUCTURE
The semiconductor die package includes a package substrate, two semiconductor dies arranged in a first direction, and a ring structure surrounding the semiconductor dies.
- The ring structure consists of a first part with a higher height and a second part recessed from the bottom surface with a lower height.
- The first part of the ring structure has multiple higher parts in side areas, while the second part has multiple lower parts between the higher parts.
- The lower parts include first lower parts in corner areas and second lower parts in opposite side areas extending in the first direction.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the thermal management and overall performance of semiconductor components in high-power applications.
Problems Solved: - Enhances the structural integrity and thermal dissipation of semiconductor packages. - Provides a more efficient and reliable packaging solution for semiconductor dies.
Benefits: - Improved thermal performance and reliability of semiconductor packages. - Enhanced structural stability and durability of electronic devices.
Commercial Applications: Title: Advanced Semiconductor Die Packaging Technology for Enhanced Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, and computers, where efficient thermal management is crucial for optimal operation.
Questions about Semiconductor Die Package Technology: 1. How does the ring structure in the semiconductor die package contribute to thermal management?
- The ring structure helps dissipate heat more effectively by providing a pathway for thermal energy to escape.
2. What are the key advantages of using this innovative packaging technology in electronic devices?
- The technology offers improved thermal performance, structural stability, and reliability, leading to enhanced overall device performance and longevity.
Original Abstract Submitted
A semiconductor die package is provided, including a package substrate, and two semiconductor dies disposed over the package substrate and arranged in a first direction. A ring structure is disposed over the package substrate and surrounds the semiconductor dies. The ring structure includes a first part having a first height and a second part recessed from the bottom surface and having a second height lower than the first height. The first part includes multiple higher parts arranged side by side in at least some of side areas of the ring structure, and the second part includes multiple lower parts between the higher parts. The lower parts include multiple first lower parts arranged in multiple corner areas of the ring structure and multiple second lower parts arranged in opposite side areas of the ring structure extending in the first direction.
