18675097. SEMICONDUCTOR DEVICE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor(s)
Wei-Kai Shih of Nantou County (TW)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18675097 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a semiconductor device with a semiconductor substrate, a passivation layer, and a conductive pattern. The conductive pattern is electrically connected to a conductive pad on the substrate, with at least one turning point on the sidewall where it interfaces with the passivation layer and the conductive pad.
- The semiconductor device includes a semiconductor substrate with a conductive pad.
- A passivation layer is present over the semiconductor substrate.
- A conductive pattern penetrates through the passivation layer and is electrically connected to the conductive pad.
- The conductive pattern has at least one turning point on the sidewall where it meets the passivation layer and the conductive pad.
Potential Applications: This technology could be used in various semiconductor devices, such as integrated circuits, sensors, and microprocessors.
Problems Solved: This innovation helps improve the electrical connectivity and performance of semiconductor devices by providing a reliable and efficient connection between the conductive pad and the conductive pattern.
Benefits: - Enhanced electrical connectivity - Improved performance of semiconductor devices - Increased reliability of connections
Commercial Applications: Potential commercial applications of this technology include the semiconductor industry for the production of advanced electronic devices.
Prior Art: Readers interested in prior art related to this technology could start by researching semiconductor device manufacturing processes and materials used in similar applications.
Frequently Updated Research: Researchers in the semiconductor industry are constantly exploring new materials and techniques to improve the performance and efficiency of semiconductor devices.
Questions about Semiconductor Devices: 1. How does the turning point on the sidewall of the conductive pattern impact the overall performance of the semiconductor device? 2. What are some potential challenges in implementing this technology on a larger scale in semiconductor manufacturing processes?
Original Abstract Submitted
One of the semiconductor devices includes a semiconductor substrate, a passivation layer and a conductive pattern. The semiconductor substrate includes a conductive pad thereover. The passivation layer over the semiconductor substrate. The conductive pattern is penetrating through the passivation layer and electrically connected to the conductive pad, wherein a sidewall of the conductive pattern interfacing with the passivation layer and the conductive pad has at least one turning point.
