18674891. SEMICONDUCTOR PACKAGE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor(s)
Ming-Chih Yew of Hsinchu City (TW)
Shu-Shen Yeh of Taoyuan City (TW)
Po-Yao Lin of Hsinchu County (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18674891 titled 'SEMICONDUCTOR PACKAGE
Simplified Explanation: The patent application describes a manufacturing method for a semiconductor package, involving the formation of a redistribution structure, bonding of an encapsulated semiconductor device to one side of the structure, and bonding of a substrate to the other side.
- The method involves forming a redistribution structure.
- An encapsulated semiconductor device is attached to one side of the structure.
- A substrate is bonded to the opposite side of the structure.
- The redistribution structure includes vias, conductive lines, and a redistribution line.
- The conductive lines have an angle greater than zero between them.
Key Features and Innovation:
- Formation of a redistribution structure.
- Encapsulation of a semiconductor device.
- Bonding of a substrate.
- Utilization of vias, conductive lines, and redistribution lines.
- Specific angle between conductive lines.
Potential Applications: This technology can be applied in the manufacturing of semiconductor packages for various electronic devices such as smartphones, tablets, and computers.
Problems Solved:
- Efficient redistribution of electrical signals.
- Enhanced structural integrity of semiconductor packages.
- Improved performance of electronic devices.
Benefits:
- Increased reliability of semiconductor packages.
- Enhanced electrical connectivity.
- Compact design for electronic devices.
Commercial Applications: The technology can be used in the production of consumer electronics, industrial equipment, and automotive systems to improve the performance and reliability of semiconductor packages.
Questions about Semiconductor Package Manufacturing: 1. How does the angle between conductive lines impact the performance of the semiconductor package? 2. What are the specific advantages of encapsulating a semiconductor device in the manufacturing process?
Frequently Updated Research: Ongoing research in semiconductor packaging focuses on improving thermal management, increasing miniaturization, and enhancing the overall performance of electronic devices.
Original Abstract Submitted
A manufacturing method of a semiconductor package includes the following steps. A redistribution structure is formed. An encapsulated semiconductor device is provided on a first side of the redistribution structure, wherein the encapsulated semiconductor device comprising a semiconductor device encapsulated by an encapsulating material. A substrate is bonded to a second side of the redistribution structure opposite to the first side. The redistribution structure includes a plurality of vias connected to one another through a plurality of conductive lines and a redistribution line connected to the plurality of vias, and, from a top view, an angle greater than zero is included between adjacent two of the plurality of conductive lines.
