18673686. PRINTED CIRCUIT BOARD (SAMSUNG ELECTRO-MECHANICS CO., LTD.)

PRINTED CIRCUIT BOARD

Organization Name

SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor(s)

Seong Hun Na of Suwon-si (KR)

Dong Yong Kim of Suwon-si (KR)

Mi Geum Kim of Suwon-si (KR)

Mi Jung Park of Suwon-si (KR)

Yong Su Lee of Suwon-si (KR)

Ho Seung Jang of Suwon-si (KR)

Sang Ik Cho of Suwon-si (KR)

Sung Han of Suwon-si (KR)

Sung Hoon Kim of Suwon-si (KR)

PRINTED CIRCUIT BOARD

This abstract first appeared for US patent application 18673686 titled 'PRINTED CIRCUIT BOARD

Original Abstract Submitted

A printed circuit board includes a glass layer, a through-hole penetrating through the glass layer, a seed layer provided along an inner wall of the through-hole, and a through-via disposed on the seed layer and filling the through-hole. The seed layer includes a carbon-based conductive material.