18673328. SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Organization Name

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor(s)

Kai-Ming Ching of Hsinchu County (TW)

Shu-Shen Yeh of Taoyuan City (TW)

Chien-Hung Chen of Taipei (TW)

Hui-Chang Yu of Hsinchu County (TW)

Yu-Min Cheng of Hsinchu (TW)

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A simplified explanation of the abstract

This abstract first appeared for US patent application 18673328 titled 'SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Simplified Explanation:

The semiconductor package consists of a substrate, a semiconductor die, a ring structure, and a lid. The die is placed on the substrate, surrounded by the ring structure, with the lid on top.

• The semiconductor die is positioned on the substrate.
• The ring structure encircles the semiconductor die with specific gaps on each side.
• The lid covers the ring structure and overlaps with one of the gaps.

Key Features and Innovation:

• Efficient placement of the semiconductor die within the package.
• Ring structure provides support and protection to the die.
• Lid design ensures proper sealing and protection of the components.

Potential Applications:

This technology can be used in various electronic devices such as smartphones, computers, and automotive systems.

Problems Solved:

• Ensures proper alignment and protection of the semiconductor die.
• Enhances the overall durability and reliability of the package.

Benefits:

• Improved performance and longevity of electronic devices.
• Enhanced protection against external factors such as dust and moisture.

Commercial Applications:

Potential commercial applications include semiconductor manufacturing companies, electronics manufacturers, and automotive industry suppliers.

Questions about Semiconductor Package Technology:

1. How does the ring structure contribute to the overall stability of the semiconductor package? 2. What are the specific advantages of the lid design in protecting the components within the package?

Frequently Updated Research:

Ongoing research focuses on optimizing the design of semiconductor packages for increased efficiency and performance.

Original Abstract Submitted

A semiconductor package includes a substrate, a semiconductor die, a ring structure and a lid. The semiconductor die is disposed on the substrate. The ring structure is disposed on the substrate and surrounds the semiconductor die, where a first side of the semiconductor die is distant from an inner sidewall of the ring structure by a first gap, and a second side of the semiconductor die is distant from the inner sidewall of the ring structure by a second gap. The first side is opposite to the second side, and the first gap is less than the second gap. The lid is disposed on the ring structure and has a recess formed therein, and the recess overlaps with the first gap in a stacking direction of the ring structure and the lid.