18672001. METHOD OF FABRICATING PACKAGE STRUCTURE simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.)
Contents
- 1 METHOD OF FABRICATING PACKAGE STRUCTURE
- 1.1 Organization Name
- 1.2 Inventor(s)
- 1.3 METHOD OF FABRICATING PACKAGE STRUCTURE - A simplified explanation of the abstract
- 1.4 Simplified Explanation
- 1.5 Key Features and Innovation
- 1.6 Potential Applications
- 1.7 Problems Solved
- 1.8 Benefits
- 1.9 Commercial Applications
- 1.10 Prior Art
- 1.11 Frequently Updated Research
- 1.12 Questions about Semiconductor Package Structure
- 1.13 Original Abstract Submitted
METHOD OF FABRICATING PACKAGE STRUCTURE
Organization Name
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor(s)
Sen-Kuei Hsu of Kaohsiung City (TW)
METHOD OF FABRICATING PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18672001 titled 'METHOD OF FABRICATING PACKAGE STRUCTURE
Simplified Explanation
The patent application describes a package structure for a semiconductor device that includes various layers and elements for efficient heat dissipation and electrical connectivity.
Key Features and Innovation
- Semiconductor die encapsulated in insulating material
- First redistribution layer with feed line and ground plate
- Second redistribution layer connected to semiconductor die and first redistribution layer
- Heat dissipation element with conductive base and antenna patterns
- Antenna patterns electrically connected to feed line and ground plate
Potential Applications
This technology can be used in various electronic devices that require efficient heat dissipation and reliable electrical connections, such as smartphones, tablets, and other portable electronics.
Problems Solved
This technology addresses the challenges of heat dissipation and electrical connectivity in semiconductor devices, ensuring optimal performance and reliability.
Benefits
- Improved heat dissipation
- Enhanced electrical connectivity
- Increased device performance and reliability
Commercial Applications
- This technology can be applied in the consumer electronics industry to improve the performance and reliability of electronic devices.
- It can also be utilized in the automotive industry for advanced driver assistance systems and other electronic components.
Prior Art
Readers can explore prior art related to semiconductor packaging technologies, heat dissipation methods, and electrical connectivity solutions in the field of semiconductor devices.
Frequently Updated Research
Researchers are constantly developing new materials and techniques to improve heat dissipation and electrical connectivity in semiconductor devices. Stay updated on the latest advancements in the field.
Questions about Semiconductor Package Structure
What are the key components of a semiconductor package structure?
A semiconductor package structure typically includes a semiconductor die, insulating material, redistribution layers, heat dissipation elements, and conductive elements for electrical connections.
How does heat dissipation impact the performance of semiconductor devices?
Efficient heat dissipation is crucial for maintaining the optimal operating temperature of semiconductor devices, which can significantly impact their performance and reliability.
Original Abstract Submitted
A package structure includes a semiconductor die, an insulating encapsulant, a first redistribution layer, a second redistribution layer, a heat dissipation element and conductive balls. The insulating encapsulant is encapsulating the semiconductor die, and has a first surface and a second surface opposite to the first surface. The first redistribution layer is located on the first surface of the insulating encapsulant and includes at least one feed line and one ground plate. The second redistribution layer is located on the second surface of the insulating encapsulant and electrically connected to the semiconductor die and the first redistribution layer. The heat dissipation element is disposed on the first redistribution layer and includes a conductive base and antenna patterns, wherein the antenna patterns is electrically connected to the feed line and is electrically coupled to the ground plate of the first redistribution layer.
