18669914. SEMICONDUCTOR DEVICE simplified abstract (DENSO CORPORATION)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
MASAKAZU Watanabe of Kariya-city (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18669914 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation:
The semiconductor device described in the abstract consists of a semiconductor element and a terminal substrate. The semiconductor element has a main electrode and a control electrode on one surface, while the terminal substrate has a bonding terminal for wire bonding on one surface and a relay terminal on the other surface. These terminals are electrically connected, with the bonding terminal being larger than the control electrode. The semiconductor element is bonded to the terminal substrate so that the relay terminal and the control electrode are in contact, with a step on the substrate ensuring contact between the side surface of the semiconductor element.
- The semiconductor device includes a semiconductor element with main and control electrodes, and a terminal substrate with bonding and relay terminals.
- The bonding terminal on the terminal substrate is larger than the control electrode on the semiconductor element.
- The relay terminal and control electrode are in contact when the terminal substrate is bonded to the semiconductor element.
- A step on the terminal substrate ensures contact between the side surface of the semiconductor element.
Potential Applications:
This technology could be used in various semiconductor devices where precise electrical connections are required, such as in integrated circuits, power electronics, and sensors.
Problems Solved:
This technology addresses the need for reliable and efficient electrical connections in semiconductor devices, ensuring proper functionality and performance.
Benefits:
The benefits of this technology include improved electrical connectivity, enhanced device reliability, and potentially increased device lifespan due to secure bonding.
Commercial Applications:
Title: Advanced Semiconductor Device for Enhanced Electrical Connectivity
This technology could have significant commercial applications in the semiconductor industry, particularly in the development of high-performance electronic devices where reliable electrical connections are crucial. The market implications include improved product quality, increased efficiency, and potentially new opportunities for innovation in semiconductor design.
Prior Art:
Readers interested in exploring prior art related to this technology could start by researching semiconductor bonding techniques, terminal substrate designs, and semiconductor device packaging methods.
Frequently Updated Research:
Researchers in the field of semiconductor technology may find relevant and up-to-date information on advancements in semiconductor bonding technologies, materials science for terminal substrates, and reliability testing for semiconductor devices.
Questions about Semiconductor Bonding Technology:
1. What are the key factors influencing the reliability of electrical connections in semiconductor devices? 2. How does the size of bonding terminals impact the performance of semiconductor elements in electronic devices?
Original Abstract Submitted
A semiconductor device includes a semiconductor element and a terminal substrate. The semiconductor element has a main electrode and a control electrode on a first main surface. The terminal substrate has a bonding terminal to which a wire is to be bonded on a front surface and a relay terminal on a back surface. The bonding terminal and the relay terminal are electrically connected to each other. The bonding terminal has an area larger than an area of the control electrode. The terminal substrate is bonded to the semiconductor element so that the relay terminal and the control electrode are in contact with each other. The terminal substrate has a step on the back surface, and a side surface of the semiconductor element is in contact with the step.
