18669800. PROBE HEAD STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
PROBE HEAD STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Wen-Yi Lin of New Taipei City (TW)
Hao Chen of New Taipei City (TW)
Chuan-Hsiang Sun of Taoyuan City (TW)
Chen-Shien Chen of Zhubei City, Hsinchu County (TW)
PROBE HEAD STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18669800 titled 'PROBE HEAD STRUCTURE
The abstract describes a probe head structure that includes a flexible substrate, a probe pillar passing through the substrate, a redistribution structure, a wiring substrate, and a conductive bump.
- The probe head structure features a flexible substrate with a probe pillar passing through it.
- A redistribution structure is present on the top surface of the flexible substrate and the probe pillar.
- A wiring substrate is placed over the redistribution structure.
- A first conductive bump connects the wiring substrate and the redistribution structure.
Potential Applications: - This technology could be used in medical devices for precise measurements. - It could also be applied in semiconductor testing equipment for accurate testing.
Problems Solved: - The probe head structure provides a stable and reliable connection between components. - It allows for precise and accurate measurements to be taken.
Benefits: - Improved accuracy in measurements. - Enhanced stability and reliability in connections.
Commercial Applications: Title: Advanced Probe Head Structure for Precision Measurements This technology could be utilized in the development of medical devices, semiconductor testing equipment, and other precision measurement tools. The improved stability and accuracy it offers could lead to more reliable products and increased efficiency in various industries.
Questions about Probe Head Structure: 1. How does the probe head structure improve the accuracy of measurements? The probe head structure enhances accuracy by providing a stable and reliable connection between components, ensuring precise measurements can be taken consistently.
2. What are the potential applications of the probe head structure in the semiconductor industry? The probe head structure could be used in semiconductor testing equipment to facilitate accurate testing processes and improve overall efficiency in semiconductor manufacturing.
Original Abstract Submitted
A probe head structure is provided. The probe head structure includes a flexible substrate having a top surface and a bottom surface. The probe head structure includes a first probe pillar passing through the flexible substrate. The probe head structure includes a redistribution structure on the top surface of the flexible substrate and the first probe pillar. The probe head structure includes a wiring substrate over the redistribution structure. The probe head structure includes a first conductive bump connected between the wiring substrate and the redistribution structure.
