18669118. SEMICONDUCTOR PACKAGE simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
JAEGWON Jang of Hwaseong-si (KR)
KYOUNG LIM Suk of Suwon-si (KR)
MINJUN Bae of Hwaseong-si (KR)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18669118 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application consists of a redistribution substrate with an insulating layer and three redistribution patterns stacked on top of each other. These patterns are electrically connected and include wire portions and via portions.
- The redistribution substrate includes an insulating layer and three stacked redistribution patterns.
- Each redistribution pattern has wire portions parallel to the substrate's surface and via portions perpendicular to it.
- The second redistribution pattern includes fine wire patterns narrower than the wire portions of the other patterns.
Potential Applications: - This technology can be used in the manufacturing of advanced semiconductor packages for various electronic devices. - It can improve the performance and reliability of integrated circuits in smartphones, computers, and other electronic gadgets.
Problems Solved: - Enhances the electrical connectivity and signal transmission within semiconductor packages. - Increases the efficiency and functionality of integrated circuits in electronic devices.
Benefits: - Improved electrical performance and signal integrity. - Enhanced reliability and durability of semiconductor packages. - Enables the development of more compact and efficient electronic devices.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Electronic Devices This technology can be utilized in the production of high-performance electronic devices such as smartphones, tablets, laptops, and IoT devices. It can also benefit the semiconductor industry by improving the quality and functionality of integrated circuits.
Questions about Semiconductor Packaging Technology: 1. How does this technology improve the electrical connectivity within semiconductor packages? - The technology enhances electrical connectivity by providing stacked redistribution patterns with wire and via portions for efficient signal transmission.
2. What are the potential applications of this advanced semiconductor packaging technology? - The technology can be applied in various electronic devices to improve performance and reliability, such as smartphones, computers, and IoT devices.
Original Abstract Submitted
A semiconductor package includes a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate includes an insulating layer, and first, second, and third redistribution patterns disposed in the insulating layer. The first to third redistribution patterns are sequentially stacked in an upward direction and are electrically connected to each other. Each of the first to third redistribution patterns includes a wire portion that extends parallel to the top surface of the redistribution substrate. Each of the first and third redistribution patterns further includes a via portion that extends from the wire portion in a direction perpendicular to the top surface of the redistribution substrate. The second redistribution pattern further includes first fine wire patterns that are less wide than the wire portion of the second redistribution pattern.
