18668687. CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chin-Hua Wang of New Taipei City (TW)

Po-Chen Lai of Hsinchu County (TW)

Ping-Tai Chen of Taipei City (TW)

Che-Chia Yang of Taipei City (TW)

Yu-Sheng Lin of Zhubei (TW)

Po-Yao Lin of Hsinchu County (TW)

Shin-Puu Jeng of Hsinchu (TW)

CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18668687 titled 'CHIP PACKAGE STRUCTURE WITH BUFFER STRUCTURE

Simplified Explanation

The chip package structure described in the patent application includes a substrate with a buffer structure that has a lower Young's modulus than the substrate. It also features wiring structures and a chip package bonded to the wiring structure.

• The chip package structure includes a substrate with a buffer structure.
• The buffer structure has a lower Young's modulus than the substrate.
• Wiring structures are present over the buffer structure and substrate.
• The chip package is bonded to the wiring structure.
• The chip package consists of an interposer substrate and a chip structure over it.

Key Features and Innovation

• Buffer structure with lower Young's modulus than the substrate.
• Wiring structures integrated into the chip package structure.
• Overlapping corners of the interposer substrate and chip structure with the buffer structure.

Potential Applications

The technology can be applied in semiconductor packaging, integrated circuits, and electronic devices where a buffer structure with different mechanical properties is needed.

Problems Solved

The chip package structure addresses the need for improved mechanical stability and reliability in semiconductor devices by utilizing a buffer structure with a lower Young's modulus.

Benefits

• Enhanced mechanical stability and reliability.
• Improved performance of semiconductor devices.
• Potential for miniaturization and increased functionality.

Commercial Applications

• Semiconductor industry for advanced packaging solutions.
• Electronics manufacturing for high-performance devices.
• Research and development in microelectronics.

Prior Art

Readers can explore prior art related to buffer structures in semiconductor packaging, Young's modulus in materials science, and interposer substrates in chip packages.

Frequently Updated Research

Stay updated on advancements in semiconductor packaging materials, mechanical properties of buffer structures, and innovations in chip package design.

Questions about the Technology

What are the specific advantages of using a buffer structure with a lower Young's modulus in semiconductor packaging?

Using a buffer structure with a lower Young's modulus can help reduce stress on the substrate and improve the overall mechanical stability of the chip package.

How does the overlapping of corners in the chip package structure contribute to its performance and reliability?

The overlapping corners ensure better alignment and connection between the different components, enhancing the structural integrity and electrical performance of the chip package.

Original Abstract Submitted

A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a buffer structure penetrating into the substrate. A first Young's modulus of the buffer structure is less than a second Young's modulus of the substrate. The chip package structure includes a first wiring structure over the buffer structure and the substrate. The first wiring structure includes a first dielectric structure and a first wiring layer in the first dielectric structure. The chip package structure includes a chip package bonded to the first wiring structure. The chip package has an interposer substrate and a chip structure over the interposer substrate, and a first corner of the interposer substrate and a second corner of the chip structure overlap the buffer structure in a top view of the chip package and the buffer structure.