18667800. SEMICONDUCTOR PACKAGE (SAMSUNG ELECTRONICS CO., LTD.)
SEMICONDUCTOR PACKAGE
Organization Name
Inventor(s)
Kyoungok Jung of Suwon-si (KR)
Hyunwoong Han of Suwon-si (KR)
SEMICONDUCTOR PACKAGE
This abstract first appeared for US patent application 18667800 titled 'SEMICONDUCTOR PACKAGE
Original Abstract Submitted
A semiconductor package, may include: a lower redistribution structure including lower redistribution layers; a semiconductor chip on the lower redistribution structure, and electrically connected to the lower redistribution layers; connection bumps on the lower redistribution structure, and electrically connected to the lower redistribution layers; an encapsulant covering at least a portion of the semiconductor chip; an upper redistribution structure including an upper insulating layer on the semiconductor chip, and upper redistribution layers including a metal structure on the upper insulating layer; an interconnection structure that electrically connects the lower redistribution layers and the upper redistribution layer; and a metal plate on an upper surface of the metal structure, wherein the upper surface may have a first surface, a second surface around the first surface, and a third surface around the second surface, the first surface may be on the same or higher level than that of the second surface.