18667273. ELECTRONIC COMPONENT simplified abstract (Murata Manufacturing Co., Ltd.)

ELECTRONIC COMPONENT

Organization Name

Murata Manufacturing Co., Ltd.

Inventor(s)

Shinichi Yamaguchi of Nagaokakyo-shi (JP)

Shoichiro Suzuki of Nagaokakyo-shi (JP)

ELECTRONIC COMPONENT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18667273 titled 'ELECTRONIC COMPONENT

The patent application describes an electronic component with a multilayer body consisting of alternating dielectric layers and inner electrode layers. A solid solution layer at the interface between the inner electrode layer and the dielectric layer contains a first metal component in solid solution with a second metal component.

• Dielectric layer thickness ranges from 0.8 μm to 4.1 μm
• Inner electrode layer thickness ranges from 0.5 μm to 1.2 μm
• 200 to 650 layers of each dielectric and inner electrode
• Central solid solution layer located about 10 μm from an end portion
• Adjacent inner electrode layers oppose each other

Potential Applications: - Capacitors - Electronic circuits - Power supplies

Problems Solved: - Improved performance of electronic components - Enhanced reliability and durability

Benefits: - Higher capacitance - Better electrical properties - Increased efficiency

Commercial Applications: Title: Advanced Electronic Components for Enhanced Performance This technology can be used in various industries such as telecommunications, automotive, and consumer electronics to improve the performance and reliability of electronic devices.

Questions about the technology: 1. How does the solid solution layer enhance the performance of the electronic component? 2. What are the specific advantages of having a multilayer body in electronic components?

Original Abstract Submitted

An electronic component includes a multilayer body in which a dielectric layer having a thickness of about 0.8 μm or more and about 4.1 μm or less and an inner electrode layer having a thickness of about 0.5 μm or more and about 1.2 μm or less are alternately stacked, the number of each of the dielectric layer and the inner electrode layer being 200 or more and 650 or less. A solid solution layer in which a first metal component defines a solid solution with a second metal component is at an interface between the inner electrode layer and the dielectric layer, and including a central solid solution layer located about 10 μm or more from an end portion in a facing portion in a length direction and a width direction, where the adjacent inner electrode layers oppose each other.