18666091. ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS simplified abstract (CANON KABUSHIKI KAISHA)
Contents
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
Organization Name
Inventor(s)
ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS - A simplified explanation of the abstract
This abstract first appeared for US patent application 18666091 titled 'ELECTRONIC COMPONENT, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS
The abstract describes a manufacturing method for an electronic component involving the bonding of two structures with electrodes via a curing process using light irradiation through a window portion.
- First structure with a first electrode on a substrate
- Second structure with a second electrode on another substrate
- Curing a bonding member between the two structures
- Applying force to pressurize the bonding member
- At least one electrode includes a window portion
- Curing process involves light irradiation through the window portion
Potential Applications: - Manufacturing of electronic components - Semiconductor industry - Microelectronics
Problems Solved: - Efficient bonding of electronic components - Precise alignment of electrodes - Enhanced durability of the bonding member
Benefits: - Improved reliability of electronic components - Cost-effective manufacturing process - Increased productivity in production
Commercial Applications: - Production of integrated circuits - Assembly of sensors and actuators - Manufacturing of electronic devices
Prior Art: Prior research may include methods for bonding electronic components using different curing techniques and materials.
Frequently Updated Research: Ongoing research may focus on optimizing the curing process for enhanced bonding strength and efficiency.
Questions about the Manufacturing Method of an Electronic Component: 1. How does the curing process using light irradiation through a window portion improve the bonding of electronic components? 2. What are the potential challenges in implementing this manufacturing method on a large scale?
Original Abstract Submitted
A manufacturing method of an electronic component includes preparing a first structure in which a first electrode is arranged on a first main surface of a first substrate, preparing a second structure in which a second electrode is arranged on a first main surface of a second substrate, and curing a bonding member while making the first main surface of the first substrate and the first main surface of the second substrate face each other via the bonding member and applying a force to the first structure and the second structure so as to pressurize the bonding member. At least one of the first electrode and the second electrode includes a window portion. In the curing, the bonding member is cured by irradiating the bonding member with light through the window portion.