18664508. SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Po-Hao Tsai of Zhongli City (TW)
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18664508 titled 'SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
The patent application describes a device with a unique antenna structure and a molding material that surrounds various components.
- The device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar that are electrically connected.
- An antenna structure with a second antenna different from the first one is positioned over the first semiconductor device.
- The antenna structure has an external connection bonded to the first conductive pillar.
- A molding material extends between the antenna structure and the redistribution structure, surrounding the components.
Potential Applications: - This technology could be used in wireless communication devices. - It may find applications in IoT devices for improved connectivity.
Problems Solved: - Provides a compact and efficient antenna structure for electronic devices. - Ensures proper electrical connections between components.
Benefits: - Enhanced wireless communication capabilities. - Improved reliability and performance of electronic devices.
Commercial Applications: Title: Advanced Antenna Technology for Enhanced Connectivity This technology could be utilized in smartphones, tablets, and other wireless devices to improve signal strength and connectivity, leading to better user experience and customer satisfaction.
Questions about the technology: 1. How does this antenna structure differ from traditional designs? - The antenna structure in this technology includes a unique external connection and molding material for improved performance. 2. What advantages does the use of a first conductive pillar offer in this device? - The first conductive pillar allows for efficient electrical connections within the device.
Original Abstract Submitted
A device includes a redistribution structure, a first semiconductor device, a first antenna, and a first conductive pillar on the redistribution structure that are electrically connected to the redistribution structure, an antenna structure over the first semiconductor device, wherein the antenna structure includes a second antenna that is different from the first antenna, wherein the antenna structure includes an external connection bonded to the first conductive pillar, and a molding material extending between the antenna structure and the redistribution structure, the molding material surrounding the first semiconductor device, the first antenna, the external connection, and the first conductive pillar.
