18663782. MODULE simplified abstract (Murata Manufacturing Co., Ltd.)
Contents
MODULE
Organization Name
Murata Manufacturing Co., Ltd.
Inventor(s)
Yoshihito Otsubo of Nagaokakyo-shi (JP)
MODULE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18663782 titled 'MODULE
The abstract describes a module consisting of electronic components mounted on substrates, with the components facing each other and connected through wire bonding and face bonding.
- First electronic component with two surfaces
- Second electronic component with two surfaces
- First substrate with two surfaces
- Second substrate with two surfaces
- Components facing each other with one inside an opening
- Components mounted on substrates using face bonding and wire bonding
Potential Applications: - Electronics manufacturing - Semiconductor industry - Circuit board assembly
Problems Solved: - Efficient component mounting - Secure electronic connections - Space-saving design
Benefits: - Improved electronic device performance - Enhanced durability - Streamlined manufacturing processes
Commercial Applications: Title: Advanced Electronic Module for High-Performance Devices This technology can be used in the production of smartphones, tablets, and other electronic devices to enhance their performance and reliability. The market implications include increased demand for high-quality electronic components in various industries.
Questions about the technology: 1. How does the face bonding method improve the stability of the electronic components? 2. What are the advantages of wire bonding in connecting the components?
Original Abstract Submitted
A module comprises: a first electronic component having a first component surface and a second component surface; a second electronic component having a third component surface and a fourth component surface; a first substrate having a first substrate surface and a second substrate surface; and a second substrate having a third substrate surface and a fourth substrate surface, the second substrate being disposed so as to overlap the first substrate while being spaced from the first substrate, the first electronic component and the second electronic component being disposed such that the second component surface and the third component surface face each other, at least a portion of the second electronic component being disposed inside an opening, the first electronic component being mounted on the second substrate surface by face bonding, the second electronic component being wire-bonded to the fourth substrate surface using a second connection terminal.
