18663697. METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Chung-Hao Tsai of Huatan Township (TW)

Chia-Chia Lin of Kaohsiung City (TW)

Kai-Chiang Wu of Hsinchu (TW)

Chuei-Tang Wang of Taichung City (TW)

Chen-Hua Yu of Hsinchu (TW)

METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT - A simplified explanation of the abstract

This abstract first appeared for US patent application 18663697 titled 'METHODS OF FORMING SEMICONDUCTOR PACKAGES HAVING A DIE WITH AN ENCAPSULANT

The embodiment described in the patent application is a device that includes an integrated circuit die with an active side and a back side, encapsulated by a molding compound, and a first redistribution structure with a metallization pattern and a dielectric layer, forming an inductor.

• Integrated circuit die with active and back sides
• Molding compound encapsulation
• First redistribution structure with metallization pattern and dielectric layer
• Inductor formed by a portion of the metallization pattern

Potential Applications: - Electronics manufacturing - Semiconductor industry - Circuit design and development

Problems Solved: - Enhancing the functionality of integrated circuits - Improving the performance of electronic devices - Facilitating miniaturization of components

Benefits: - Increased efficiency in circuit design - Enhanced functionality of electronic devices - Improved performance of integrated circuits

Commercial Applications: Title: "Advanced Integrated Circuit Technology for Enhanced Electronics" This technology can be utilized in various commercial applications such as mobile devices, computers, automotive electronics, and IoT devices, leading to improved performance and functionality in these products.

Prior Art: Readers can explore prior art related to integrated circuit design, inductor technology, and semiconductor packaging to gain a deeper understanding of the innovation presented in the patent application.

Frequently Updated Research: Stay informed about the latest advancements in integrated circuit technology, semiconductor packaging, and inductor design to keep up with the evolving landscape of electronic devices.

Questions about the Technology: 1. How does the inductor formed by the metallization pattern contribute to the functionality of the integrated circuit? 2. What are the potential implications of this technology on the semiconductor industry and electronics manufacturing?

Original Abstract Submitted

An embodiment is a device including an integrated circuit die having an active side and a back side, the back side being opposite the active side, a molding compound encapsulating the integrated circuit die, and a first redistribution structure overlying the integrated circuit die and the molding compound, the first redistribution structure including a first metallization pattern and a first dielectric layer, the first metallization pattern being electrically coupled to the active side of the integrated circuit die, at least a portion of the first metallization pattern forming an inductor.