18663670. METHODS OF FORMING SEMICONDUCTOR PACKAGES simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

METHODS OF FORMING SEMICONDUCTOR PACKAGES

Organization Name

Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor(s)

Kuo Lung Pan of Hsinchu (TW)

Shu-Rong Chun of Zhubei City (TW)

Teng-Yuan Lo of Hsinchu (TW)

Hung-Yi Kuo of Taipei City (TW)

Chih-Horng Chang of Taipei City (TW)

Tin-Hao Kuo of Hsinchu (TW)

Hao-Yi Tsai of Hsinchu (TW)

METHODS OF FORMING SEMICONDUCTOR PACKAGES - A simplified explanation of the abstract

This abstract first appeared for US patent application 18663670 titled 'METHODS OF FORMING SEMICONDUCTOR PACKAGES

The abstract of the patent application describes a device with a first redistribution structure, a die adhered to the structure, an encapsulant encapsulating the die, a through via, and first conductive connectors connected to the redistribution structure.

• The device includes a first redistribution structure with a dielectric layer.
• A die is attached to one side of the first redistribution structure.
• An encapsulant surrounds the die, bonded to the dielectric layer with covalent bonds.
• A through via extends through the encapsulant.
• First conductive connectors are linked to the other side of the redistribution structure, with some overlapping the encapsulant-die interface.

Potential Applications: - This technology could be used in semiconductor packaging for electronic devices. - It may find applications in the manufacturing of microchips and integrated circuits.

Problems Solved: - Provides a secure and reliable method of encapsulating and connecting dies in electronic devices. - Enhances the structural integrity and performance of semiconductor devices.

Benefits: - Improved durability and longevity of electronic components. - Enhanced electrical connectivity and signal transmission efficiency.

Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Device Performance This technology can be utilized in the production of high-performance electronic devices such as smartphones, computers, and IoT devices. It can also benefit industries like telecommunications, automotive, and aerospace.

Questions about the technology: 1. How does this technology improve the reliability of electronic devices? 2. What are the potential cost savings associated with implementing this semiconductor packaging technology?

Original Abstract Submitted

In an embodiment, a device includes: a first redistribution structure including a first dielectric layer; a die adhered to a first side of the first redistribution structure; an encapsulant laterally encapsulating the die, the encapsulant being bonded to the first dielectric layer with first covalent bonds; a through via extending through the encapsulant; and first conductive connectors electrically connected to a second side of the first redistribution structure, a subset of the first conductive connectors overlapping an interface of the encapsulant and the die.