18663314. PATTERNED CONDUCTIVE ARTICLE simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)

PATTERNED CONDUCTIVE ARTICLE

Organization Name

3M INNOVATIVE PROPERTIES COMPANY

Inventor(s)

Raymond P. Johnston of Lake Elmo MN (US)

Kevin W. Gotrik of Hudson WI (US)

John J. Sullivan of Hudson WI (US)

Kenneth A.P. Meyer of Eagan MN (US)

Joseph C. Carls of Austin TX (US)

Haiyan Zhang of Lake Elmo MN (US)

Gregory L. Abraham of Austin TX (US)

Matthew S. Stay of Bloomington MN (US)

PATTERNED CONDUCTIVE ARTICLE - A simplified explanation of the abstract

This abstract first appeared for US patent application 18663314 titled 'PATTERNED CONDUCTIVE ARTICLE

The abstract of this patent application describes a patterned conductive article that includes a substrate with a groove, a conductive seed layer in the groove, and a unitary conductive body in the groove.

• The conductive seed layer covers the bottom surface of the groove, while the unitary conductive body covers the seed layer and the side surfaces of the groove.
• The unitary conductive body has lower line edge roughness at the interface with the side surfaces compared to the seed layer.
• The innovation involves the precise deposition and coverage of the conductive materials within the groove to enhance conductivity and structural integrity.

Potential Applications:

• This technology can be used in electronic devices, sensors, and other applications requiring precise and reliable conductive patterns.

Problems Solved:

• Provides a solution for improving conductivity and structural integrity in patterned conductive articles.

Benefits:

• Enhanced conductivity and structural integrity.
• Precise deposition of conductive materials.

Commercial Applications:

• This technology can be applied in the manufacturing of electronic devices, sensors, and other high-tech products.

Questions about the technology: 1. How does the lower line edge roughness of the unitary conductive body improve the performance of the conductive article? 2. What are the potential cost-saving implications of using this technology in manufacturing processes?

Original Abstract Submitted

A patterned conductive article includes a substrate having a first groove therein; a conductive seed layer disposed in the first groove; and a unitary conductive body disposed at least partially in the first groove. The conductive seed layer covers at least a majority of a bottom surface of the first groove, and the unitary conductive body covers the conductive seed layer and at least a majority of side surfaces of the first groove. In a plane through the unitary conductive body that is parallel to and separate from the conductive seed layer, the unitary conductive body has a lower first line edge roughness at a first interface with the side surfaces and the conductive seed layer has a higher second line edge roughness at an edge of the conductive seed layer.