18663089. SEMICONDUCTOR PACKAGE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
SEMICONDUCTOR PACKAGE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Sen-Kuei Hsu of Kaohsiung City (TW)
Chien-Chang Lin of New Taipei City (TW)
SEMICONDUCTOR PACKAGE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18663089 titled 'SEMICONDUCTOR PACKAGE
The semiconductor package described in the patent application includes a semiconductor die, a stack of polymer layers, redistribution elements, and a passive filter. The polymer layers cover the front surface of the semiconductor die, while the redistribution elements and passive filter are located within the stack of polymer layers. The passive filter consists of a ground plane and conductive patches, with the ground plane overlapping the conductive patches and the patches being laterally separated from each other. The ground plane is connected to a reference voltage, while the conductive patches can be connected to the ground plane, floated, or linked to a direct current (DC) voltage.
- The semiconductor package includes a semiconductor die, polymer layers, redistribution elements, and a passive filter.
- The polymer layers cover the front surface of the semiconductor die.
- The passive filter comprises a ground plane and conductive patches that are electrically connected in various ways.
- The ground plane is linked to a reference voltage.
- The conductive patches can be connected to the ground plane, floated, or connected to a DC voltage.
Potential Applications: - This technology can be used in various electronic devices that require efficient filtering and redistribution of signals. - It can be applied in telecommunications equipment, consumer electronics, and automotive systems.
Problems Solved: - Provides effective filtering and redistribution of signals within a semiconductor package. - Enhances the performance and reliability of electronic devices by reducing interference and noise.
Benefits: - Improved signal quality and reliability. - Enhanced performance of electronic devices. - Cost-effective solution for signal filtering and redistribution.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Signal Filtering and Redistribution This technology can be utilized in the development of high-performance electronic devices such as smartphones, tablets, and IoT devices. The improved signal quality and reliability offered by this semiconductor package can lead to better user experiences and increased market competitiveness for manufacturers.
Questions about Semiconductor Package Technology: 1. How does the passive filter in the semiconductor package contribute to signal quality? 2. What are the potential cost savings associated with implementing this technology in electronic devices?
Frequently Updated Research: Ongoing research in semiconductor packaging technologies focuses on enhancing signal processing capabilities and reducing power consumption in electronic devices. Stay updated on the latest advancements in this field to leverage cutting-edge innovations for future product development.
Original Abstract Submitted
A semiconductor package is provided. The semiconductor package includes a semiconductor die, a stack of polymer layers, redistribution elements and a passive filter. The polymer layers cover a front surface of the semiconductor die. The redistribution elements and the passive filter are disposed in the stack of polymer layers. The passive filter includes a ground plane and conductive patches. The ground plane is overlapped with the conductive patches, and the conductive patches are laterally separated from one another. The ground plane is electrically coupled to a reference voltage. The conductive patches are electrically connected to the ground plane, electrically floated, or electrically coupled to a direct current (DC) voltage.
