18660967. SEMICONDUCTOR DEVICE simplified abstract (ROHM Co., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Hiroaki Matsubara of Kyoto-shi (JP)
Taro Nishioka of Kyoto-shi (JP)
Yoshizo Osumi of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18660967 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the patent application consists of a first semiconductor element, a second semiconductor element, an insulating element connecting the two semiconductor elements and insulating them from each other, and a sealing resin that covers all components.
- The sealing resin has two portions - a first portion covering the semiconductor elements and the insulating element, and a second portion forming the outermost surface of the resin.
- The second portion of the sealing resin is designed to be less susceptible to a tracking phenomenon compared to the first portion.
Potential Applications: - This technology can be applied in various electronic devices that require reliable insulation and protection for semiconductor components. - It can be used in automotive electronics, consumer electronics, and industrial equipment where robust semiconductor packaging is essential.
Problems Solved: - Provides effective insulation and protection for semiconductor elements, reducing the risk of electrical failures. - Addresses the issue of tracking phenomenon, which can lead to electrical breakdown in semiconductor devices.
Benefits: - Enhanced reliability and longevity of semiconductor devices. - Improved performance and durability in harsh operating conditions. - Cost-effective solution for semiconductor packaging.
Commercial Applications: Title: Advanced Semiconductor Packaging Technology for Enhanced Reliability This technology can be utilized in the manufacturing of automotive electronic control units, smart devices, and industrial sensors to ensure long-term performance and reliability in demanding environments. The market implications include increased product lifespan, reduced maintenance costs, and improved overall quality of electronic systems.
Questions about Semiconductor Device Packaging: 1. How does the second portion of the sealing resin prevent the tracking phenomenon? The second portion of the sealing resin is formulated with specific additives or materials that enhance its resistance to tracking, reducing the risk of electrical breakdown.
2. What are the key advantages of using this advanced semiconductor packaging technology? The main advantages include improved reliability, extended lifespan of semiconductor devices, and enhanced performance in challenging operating conditions.
Original Abstract Submitted
A semiconductor device includes: a first semiconductor element; a second semiconductor element; an insulating element electrically connected to the first semiconductor element and the second semiconductor element, and insulating the first semiconductor element and the second semiconductor element from each other; and a sealing resin covering the first semiconductor element, the second semiconductor element, and the insulating element. The sealing resin includes a first portion covering the first semiconductor element, the second semiconductor element, and the insulating element, and a second portion constituting the outermost surface of the sealing resin. The second portion is less prone to a tracking phenomenon than the first portion.
