18659400. SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME simplified abstract (SAMSUNG ELECTRONICS CO., LTD.)
Contents
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME
Organization Name
Inventor(s)
Yeongbeom Ko of Cheonan-si (KR)
SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract
This abstract first appeared for US patent application 18659400 titled 'SEMICONDUCTOR PACKAGE INCLUDING NON-CONDUCTIVE FILM AND METHOD FOR FORMING THE SAME
The semiconductor package described in the patent application includes a semiconductor chip on a substrate, with a non-conductive film (NCF) between them.
- The semiconductor chip has an active region and a scribe lane in continuity with the active region.
- The NCF at least partially defines a recess region overlapping with the scribe lane and extending on the active region.
Potential Applications:
- This technology could be used in the manufacturing of various semiconductor devices.
- It may find applications in the electronics industry for improving the performance and reliability of semiconductor packages.
Problems Solved:
- This innovation addresses the need for improved packaging techniques for semiconductor chips.
- It helps in enhancing the structural integrity and functionality of semiconductor devices.
Benefits:
- Increased reliability and performance of semiconductor packages.
- Enhanced protection for the active region of the semiconductor chip.
- Improved manufacturing processes for semiconductor devices.
Commercial Applications:
- This technology could be valuable for semiconductor manufacturers looking to enhance the quality of their products.
- It may have implications for the development of advanced electronic devices in various industries.
Questions about the Technology: 1. How does the non-conductive film contribute to the overall structure of the semiconductor package? 2. What are the potential implications of this innovation for the semiconductor industry?
Frequently Updated Research: There may be ongoing research in the field of semiconductor packaging techniques that could further enhance the applications of this technology.
Original Abstract Submitted
A semiconductor package includes a semiconductor chip on a substrate. The semiconductor chip includes an active region, and a scribe lane in continuity with an edge of the active region. A non-conductive film (NCF) is between the substrate and the semiconductor chip, the non-conductive film (NCF) at least partially defines a recess region overlapping with the scribe lane in plan view and extending on the active region.
