18657689. ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE simplified abstract (Texas Instruments Incorporated)
Contents
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE
Organization Name
Texas Instruments Incorporated
Inventor(s)
Sylvester Ankamah-kusi of McKinney TX (US)
Rajen Manicon Murugan of Dallas TX (US)
Sreenivasan K. Koduri of Dallas TX (US)
ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18657689 titled 'ELECTRONIC DEVICE MULTILEVEL PACKAGE SUBSTRATE FOR IMPROVED ELECTROMIGRATION PREFORMANCE
The abstract describes an electronic device with a multilevel package substrate that includes conductive structures providing a conductive path along different directions.
- The electronic device has a multilevel package substrate with first and second levels extending in different directions.
- The conductive structure in the substrate has indents that extend into the conductive portions in the first level.
- The indents are spaced apart from one another along the first direction and positioned between pairs of landing areas.
Potential Applications: - This technology could be used in various electronic devices such as smartphones, tablets, and laptops. - It can also be applied in the automotive industry for advanced electronic systems in vehicles.
Problems Solved: - Provides a reliable and efficient conductive path within the electronic device. - Helps in reducing signal interference and improving overall performance.
Benefits: - Enhanced functionality and performance of electronic devices. - Improved signal transmission and reduced signal loss.
Commercial Applications: Title: Advanced Electronic Packaging Technology for Enhanced Device Performance This technology can be utilized by electronics manufacturers to improve the performance and reliability of their products, leading to increased customer satisfaction and market competitiveness.
Questions about Electronic Device Packaging Technology: 1. How does this technology improve signal transmission within electronic devices? This technology enhances signal transmission by providing a reliable conductive path along different directions within the device.
2. What are the potential applications of this electronic device packaging technology? This technology can be applied in various electronic devices and industries, including consumer electronics and automotive electronics.
Original Abstract Submitted
An electronic device includes a multilevel package substrate with first and second levels extending in planes of first and second directions and spaced apart from one another along a third direction, the first level having a first side with landing areas spaced apart from one another along the first direction. The multilevel package substrate includes a conductive structure having first and second ends and conductive portions in the first and second levels that provide a conductive path along the first direction from the landing areas toward the second end, where the conductive structure includes indents that extend into the conductive portions in the first level, the indents spaced apart from one another along the first direction and positioned along the first direction between respective pairs of the landing areas.
