18654247. NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION simplified abstract (Texas Instruments Incorporated)

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

Organization Name

Texas Instruments Incorporated

Inventor(s)

Nazila Dadvand of Richardson TX (US)

NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION - A simplified explanation of the abstract

This abstract first appeared for US patent application 18654247 titled 'NEUTRAL pH COPPER PLATING SOLUTION FOR UNDERCUT REDUCTION

The abstract describes a method of forming a microelectronic device using a seed layer primarily composed of zinc, a plating mask, a copper strike layer, and a main copper layer.

• Seed layer contains primarily zinc
• Plating mask is formed over the seed layer
• Copper strike layer is formed using a neutral pH copper plating bath
• Main copper layer is plated on the copper strike layer
• Heating process diffuses copper and zinc to form a brass layer
• Remaining seed layer is removed by wet etch process
• Main copper layer and brass layer provide a conductor structure

Potential Applications: - Microelectronics - Semiconductor devices - Printed circuit boards

Problems Solved: - Efficient formation of microelectronic devices - Improved conductivity and reliability

Benefits: - Enhanced performance of microelectronic devices - Cost-effective manufacturing process - Increased durability and longevity

Commercial Applications: Title: "Advanced Microelectronic Device Manufacturing Process" This technology can be used in the production of various microelectronic devices, such as smartphones, tablets, and computers. The improved conductivity and reliability offered by this method can benefit the electronics industry by enhancing the performance of electronic devices and reducing manufacturing costs.

Questions about the technology: 1. How does the diffusion of copper and zinc contribute to the formation of the brass layer?

  - The diffusion process allows for the creation of a brass layer that enhances the conductivity and durability of the microelectronic device.

2. What are the advantages of using a neutral pH copper plating bath in the formation of the copper strike layer?

  - The neutral pH copper plating bath ensures a more controlled and efficient plating process, resulting in a higher quality microelectronic device.

Original Abstract Submitted

A microelectronic device is formed by forming a seed layer that contains primarily zinc. A plating mask is formed over the seed layer, and a copper strike layer is formed on the seed layer using a neutral pH copper plating bath. A main copper layer is formed on the copper strike layer by plating copper on the copper strike layer. The plating mask is subsequently removed. The main copper layer, the copper strike layer, and the seed layer are heated to diffuse copper and zinc, and form a brass layer under the main copper layer, consuming the seed layer between the main copper layer and the substrate. Remaining portions of the seed layer are removed by a wet etch process. The main copper layer and the underlying brass layer provide a conductor structure.