18654238. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18654238 titled 'SEMICONDUCTOR DEVICE
Simplified Explanation: The semiconductor device described in the abstract includes a chip with various components arranged on its main surface.
- A main surface electrode is positioned on the main surface of the chip.
- A terminal electrode is placed on the main surface electrode.
- A sealing insulator covers the periphery of the terminal electrode, leaving a portion exposed.
- A terminal film covers the terminal electrode.
Key Features and Innovation:
- Integration of main surface and terminal electrodes on a semiconductor chip.
- Use of a sealing insulator to protect the terminal electrode.
- Terminal film for additional protection and functionality.
Potential Applications:
- Semiconductor industry for electronic devices.
- Integrated circuits and microprocessors.
- Power electronics and communication systems.
Problems Solved:
- Protection of terminal electrodes from external elements.
- Enhanced durability and reliability of semiconductor devices.
- Improved performance and functionality of electronic components.
Benefits:
- Increased longevity of semiconductor devices.
- Enhanced electrical conductivity and signal transmission.
- Greater efficiency and reliability in electronic systems.
Commercial Applications:
- Semiconductor manufacturing companies.
- Electronics and technology firms.
- Research and development organizations in the semiconductor industry.
Prior Art: Prior art related to this technology may include patents or publications on semiconductor device packaging and electrode protection methods.
Frequently Updated Research: Ongoing research in semiconductor materials, packaging techniques, and device miniaturization may be relevant to this technology.
Questions about Semiconductor Devices: 1. What are the key components of a semiconductor device? 2. How does the integration of main surface and terminal electrodes benefit electronic systems?
Original Abstract Submitted
A semiconductor device includes a chip that has a main surface, a main surface electrode that is arranged on the main surface, a terminal electrode that is arrange on the main surface electrode, a sealing insulator that covers a periphery of the terminal electrode on the main surface such as to expose a part of the terminal electrode, and a terminal film that covers the terminal electrode.
