18652969. MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
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MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18652969 titled 'MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
Simplified Explanation:
This patent application describes a manufacturing method for a semiconductor device that involves preparing a wafer source, forming electrodes, and cutting the wafer to create sealed and unsealed wafers.
- The method involves preparing a wafer source with two main surfaces, forming electrodes on one surface, and cutting the wafer to separate it into sealed and unsealed wafers.
Key Features and Innovation:
- Preparation of a wafer source with two main surfaces.
- Formation of main surface and terminal electrodes.
- Creation of a sealing insulator to cover the terminal electrode.
- Cutting the wafer to separate it into sealed and unsealed wafers.
Potential Applications:
This technology can be applied in the manufacturing of various semiconductor devices such as integrated circuits, sensors, and transistors.
Problems Solved:
This technology addresses the need for a method to efficiently manufacture semiconductor devices with precise cutting and sealing processes.
Benefits:
- Improved efficiency in semiconductor device manufacturing.
- Enhanced precision in cutting and sealing processes.
- Potential cost savings in production.
Commercial Applications:
The technology can be utilized in the semiconductor industry for the mass production of high-quality devices, leading to increased competitiveness and market share.
Prior Art:
Further research can be conducted in the field of semiconductor device manufacturing methods to explore existing techniques and innovations.
Frequently Updated Research:
Researchers are continually exploring new methods and materials for semiconductor device manufacturing to enhance performance and efficiency.
Questions about Semiconductor Device Manufacturing:
1. What are the key steps involved in the manufacturing of semiconductor devices using this method? 2. How does the cutting process in this method contribute to the overall efficiency of semiconductor device production?
Original Abstract Submitted
A manufacturing method for a semiconductor device includes a step of preparing a wafer source that has a first main surface on one side and a second main surface on the other side, a step of forming a main surface electrode on the first main surface, a step of forming a terminal electrode on the main surface electrode, a step of forming a sealing insulator that covers a periphery of the terminal electrode on the first main surface such as to expose a part of the terminal electrode, and a step of cutting the wafer source in a horizontal direction along the first main surface from an intermediate portion of a thickness range of the wafer source, and separating the wafer source into a sealed wafer on the sealing insulator side and an unsealed wafer on the second surface side.
