18652779. PACKAGE STRUCTURE simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)
Contents
PACKAGE STRUCTURE
Organization Name
Taiwan Semiconductor Manufacturing Company, Ltd.
Inventor(s)
Hung-Jui Kuo of Hsinchu City (TW)
Tai-Min Chang of Taipei City (TW)
PACKAGE STRUCTURE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18652779 titled 'PACKAGE STRUCTURE
The abstract describes a package structure consisting of a first die and an encapsulant. The first die includes a substrate, pads, a passivation layer, first die connectors, and a dielectric layer. The encapsulant surrounds the first die, with one of the connectors being taper-shaped.
- The package structure includes a first die with various components such as pads, passivation layer, first die connectors, and a dielectric layer.
- The encapsulant surrounds the first die, providing protection and stability.
- One of the first die connectors is taper-shaped, with a width that gradually increases towards the passivation layer.
- The innovative design of the package structure enhances the overall performance and reliability of the electronic device.
Potential Applications: - This technology can be applied in the manufacturing of electronic devices such as integrated circuits and microprocessors. - It can be used in various industries including telecommunications, automotive, and consumer electronics.
Problems Solved: - Provides enhanced protection and stability to the first die components. - Improves the overall performance and reliability of electronic devices.
Benefits: - Increased durability and longevity of electronic devices. - Enhanced performance and functionality. - Improved manufacturing processes and efficiency.
Commercial Applications: Title: Advanced Package Structure for Electronic Devices This technology can be utilized in the production of advanced electronic devices, catering to a wide range of industries. The market implications include improved product quality, increased consumer satisfaction, and potential cost savings for manufacturers.
Questions about the Technology: 1. How does the taper-shaped die connector contribute to the overall performance of the package structure? - The taper-shaped die connector allows for a gradual increase in width towards the passivation layer, enhancing the connection and stability of the components. 2. What are the potential market opportunities for this innovative package structure in the electronics industry? - The technology can open up new possibilities for manufacturers to create more reliable and efficient electronic devices, leading to increased market demand and competitiveness.
Original Abstract Submitted
Provided is a package structure including a first die and an encapsulant. The first die includes a substrate, a plurality of pads over the substrate, a passivation layer on portions of each of the plurality of pads, a plurality of first die connectors on the plurality of pads, respectively and a dielectric layer laterally encapsulating the plurality of first die connectors. The encapsulant laterally encapsulates the first die. One of the plurality of first die connectors is a taper-shaped die connector. A width of the one of the plurality of first die connectors gradually increases from a top surface of the one of the plurality of first die connectors toward the a top surface of the passivation layer.
