18652529. METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS simplified abstract (3M INNOVATIVE PROPERTIES COMPANY)

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

Organization Name

3M INNOVATIVE PROPERTIES COMPANY

Inventor(s)

Ankit Mahajan of Cupertino CA (US)

Saagar A. Shah of Minneapolis MN (US)

Mikhail L. Pekurovsky of Bloomington MN (US)

Kayla C. Niccum of Maplewood MN (US)

Kara A. Meyers of Oakdale MN (US)

Matthew R.D. Smith of Woodbury MN (US)

Gino L. Pitera of St. Paul MN (US)

Graham M. Clarke of Woodbury MN (US)

Jeremy K. Larsen of Farmington MN (US)

Teresa M. Goeddel of St. Paul MN (US)

METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS - A simplified explanation of the abstract

This abstract first appeared for US patent application 18652529 titled 'METHODS FOR REGISTRATION OF CIRCUIT DIES AND ELECTRICAL INTERCONNECTS

The method described in the abstract involves placing an electronic device on a pliable mating surface on a major surface of a mold, where at least one contact pad on the electronic device presses against the pliable mating surface. A liquid encapsulant material is then applied over the electronic device and the major surface of the mold, which is hardened to form a carrier for the electronic device. The mold and the carrier are separated, allowing the microstructures on the mold to form corresponding microchannels in the carrier, with at least one contact pad exposed in a microchannel. A conductive particle-containing liquid is deposited in the microchannel, directly contacting the exposed contact pad.

• The method involves using a pliable mating surface on a mold to create microchannels in a carrier for an electronic device.
• Liquid encapsulant material is applied and hardened to form the carrier.
• Microstructures on the mold create corresponding microchannels in the carrier.
• Conductive particle-containing liquid is deposited in the microchannel to directly contact the contact pad.
• This innovation allows for efficient and precise connection of electronic devices within a carrier.

Potential Applications: - This method can be used in the manufacturing of electronic devices with complex internal structures. - It can be applied in the production of miniaturized electronic components. - The technology can find applications in the development of wearable technology and IoT devices.

Problems Solved: - Provides a method for creating microchannels in a carrier for electronic devices. - Ensures precise and reliable connections between electronic components. - Facilitates the production of compact and efficient electronic devices.

Benefits: - Enables the creation of intricate electronic devices with precise connections. - Enhances the reliability and durability of electronic components. - Streamlines the manufacturing process for electronic devices.

Commercial Applications: Title: Innovative Method for Precise Electronic Component Integration This technology can be utilized in the production of smartphones, smartwatches, and other portable electronic devices. It can also be applied in the automotive industry for creating advanced electronic systems in vehicles.

Questions about the technology: 1. How does this method improve the reliability of electronic devices? 2. What are the potential cost-saving benefits of using this technology in electronic device manufacturing?

Original Abstract Submitted

A method includes placing an electronic device on a pliable mating surface on a major surface of a mold such that at least one contact pad on the electronic device presses against the pliable mating surface. The pliable mating surface is on a microstructure in an arrangement of microstructures on the major surface of the mold. A liquid encapsulant material is applied over the electronic device and the major surface of the mold, and then hardened to form a carrier for the electronic device. The mold and the carrier are separated such that the microstructures on the mold form a corresponding arrangement of microchannels in the carrier, and at least one contact pad on the electronic device is exposed in a microchannel in the arrangement of microchannels. A conductive particle-containing liquid is deposited in the microchannel, which directly contacts the contact pad exposed in the microchannel.