18652315. SEMICONDUCTOR DEVICE simplified abstract (ROHM CO., LTD.)
Contents
SEMICONDUCTOR DEVICE
Organization Name
Inventor(s)
Koshun Saito of Kyoto-shi (JP)
SEMICONDUCTOR DEVICE - A simplified explanation of the abstract
This abstract first appeared for US patent application 18652315 titled 'SEMICONDUCTOR DEVICE
The semiconductor device described in the abstract includes a lead with a terminal, partially covered by a sealing resin. The lead consists of a base and a metal layer covering the base, with the base having a first terminal-extending portion forming the terminal.
- The first terminal-extending portion extends in a first direction, crossing the thickness direction, and is exposed from the sealing resin.
- The first terminal-extending portion includes a first end facing in the first direction and a first side wall facing in a second direction crossing the thickness and first directions.
- The metal layer covers the first end, the first side, and the second side, provided at a location avoiding the third side.
Potential Applications: - This technology can be used in various semiconductor devices where precise lead design is crucial. - It can improve the reliability and performance of electronic components by ensuring proper sealing and protection of terminals.
Problems Solved: - Ensures proper coverage and protection of terminals in semiconductor devices. - Enhances the durability and longevity of electronic components by preventing damage to leads.
Benefits: - Improved reliability and performance of semiconductor devices. - Enhanced protection against environmental factors and mechanical stress. - Increased lifespan of electronic components due to better sealing and coverage of terminals.
Commercial Applications: Title: Advanced Lead Sealing Technology for Semiconductor Devices This technology can be applied in the manufacturing of various electronic devices such as smartphones, computers, and automotive electronics. It can also be beneficial in the aerospace and medical device industries where reliability and durability are critical.
Questions about the technology: 1. How does the metal layer covering the terminal improve the performance of the semiconductor device? 2. What are the specific advantages of having the first terminal-extending portion exposed from the sealing resin?
Original Abstract Submitted
A semiconductor device includes a lead with a terminal, and a sealing resin partially covering the terminal. The lead includes a base and metal layer covering the base. The base has a first terminal-extending portion forming the terminal. The first terminal-extending portion, exposed from the sealing resin, extends in a first direction crossing the thickness direction. The first terminal-extending portion includes a first end facing in the first direction and a first side wall facing in a second direction crossing the thickness and first directions. The first side wall has, in the first direction, a first side closer to the first end, a second side closer to the sealing resin, and a third side between the first side and the second side. The metal layer, covering the first end, the first side and the second side, is provided at a location avoiding the third side.
